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Proceedings of the INTERACT '93 and CHI '93 Conference on Human Factors in Computing Systems ,
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The growth of software skill : a longitudinal look at le..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Numerical and Experimental Investigation of Package Warpage..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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RF Performance of FOWLP to PCB Board Transition:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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A Novel Packaging Platform for High-Performance Optical Eng..:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
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Board Level Solder Joint Reliability Design and Analysis of..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
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Comprehensive Design and Analysis of Fan-Out Wafer Level Pa..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
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Application of Piezoresistive Stress Sensor in Mold-1st Fan..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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