E-LIB Suche - Ergebnisse für: Jong, Sharon

1

List of Contributors:

, In: Interventions for Addiction,

Abraham, Amanda J. ; Ait-Daoud, Nassima ; Alessi, Sheila M.... - p. xiii-xvi , 2013

Link: https://doi.org/10.1016/..

2

The growth of software skill : a longitudinal look at le..:

, In: Proceedings of the INTERACT '93 and CHI '93 Conference on Human Factors in Computing Systems,

Nilsen, Erik ; Jong, HeeSen ; Olson, Judith S.... - p. 149-156 , 1993

Link: https://dl.acm.org/doi/1..

3

Contributors:

, In: Oceans and Human Health,

Aasly, Kurt ; Abós-Herràndiz, Rafael ; Ainsworth, Gillian B.... - p. xvii-xxii , 2023

Link: https://doi.org/10.1016/..

4

Contributors:

, In: Mucosal Immunology,

Abd-Alla, Mohammed D. ; Abraham, Soman N. ; Adams, David... - p. xv-xxv , 2005

Link: https://doi.org/10.1016/..

5

Numerical and Experimental Investigation of Package Warpage..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Zhang, Xiaowu ; Lim, Sharon Pei Siang ; Lau, Boon Long... - p. 734-737 , 2023

Link: https://doi.org/10.1109/..

6

RF Performance of FOWLP to PCB Board Transition:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),

Zheng, Kai Bo ; Mei, Sun ; Siang, Sharon Lim Pei... - p. 94-97 , 2022

Link: https://doi.org/10.1109/..

7

A Novel Packaging Platform for High-Performance Optical Eng..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Gourikutty, Sajay Bhuvanendran Nair ; Jong, Ming Chinq ; Kanna, Chockanathan Vinoth... - p. 422-427 , 2022

Link: https://doi.org/10.1109/..

8

Board Level Solder Joint Reliability Design and Analysis of..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),

Zhang, Xiaowu ; Lau, Boon Long ; Chen, Haoran... - p. 316-320 , 2020

Link: https://doi.org/10.1109/..

9

Comprehensive Design and Analysis of Fan-Out Wafer Level Pa..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),

Zhang, Xiaowu ; Andriani, Yosephine ; Jong, Ming Chinq... - p. 107-110 , 2019

Link: https://doi.org/10.1109/..

10

Application of Piezoresistive Stress Sensor in Mold-1st Fan..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),

Bu, Lin ; Jong, Ming Chinq ; Lau, Boon Long... - p. 28-33 , 2019

Link: https://doi.org/10.1109/..

11

List of Contributors:

, In: Handbook of Environmental Degradation of Materials,

Banks, Bruce A. ; Berke, Neal ; Brossia, Sean... - p. xi , 2018

Link: https://doi.org/10.1016/..

12

Vertical Stacking of Heterogeneous Chiplets of Duplexer on ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Chong, Chai Tai ; Rotaru, Mihai ; Xiangyu, Wang... - p. 2017-2023 , 2024

Link: https://doi.org/10.1109/..