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2022 International Electron Devices Meeting (IEDM) ,
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3-Tier BSI CIS with 3D Sequential & Hybrid Bonding Enabling..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
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$1.62\mu \mathrm{m}$ Global Shutter Quantum Dot Image Senso..:
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2017 Symposium on VLSI Technology ,
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Impact of strain on access resistance in planar and nanowir..:
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2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers ,
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14nm FDSOI technology for high speed and energy efficient a..:
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2007 European Conference on Lasers and Electro-Optics and the International Quantum Electronics Conference ,
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Future Inertial Atomic Quantum Sensors: State of Art:
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2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104) ,
6
Well-controlled, selectively under-etched Si/SiGe gates for..:
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Acute Topics in Sport Nutrition; Medicine and Sport Science ,
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