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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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A reliable copper-free wafer level hybrid bonding technolog..:
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2019 International 3D Systems Integration Conference (3DIC) ,
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Towards a Complete Direct Hybrid Bonding D2W Integration Fl..:
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2019 International 3D Systems Integration Conference (3DIC) ,
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Die to Wafer Direct Hybid Bonding Demonstration with High A..:
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2013 IEEE 63rd Electronic Components and Technology Conference ,
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mmW characterization of wafer level passivation for 3D sili..:
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Microbiological Risk Assessment in Food Processing ,
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Microbiological risk assessment (MRA): an introduction:
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Microbiological Risk Assessment in Food Processing ,
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Microbiological risk assessment (MRA): an introduction:
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Advances in Science, Technology & Innovation; Recent Research on Sedimentology, Stratigraphy, Paleontology, Geochemistry, Volcanology, Tectonics, and Petroleum Geology ,
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The Oldest Eocene Marine Vertebrate Fauna from the Sahara D..:
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ACM SIGGRAPH 2024 Conference Papers ,
12
Modelling a Feather as a Strongly Anisotropic Elastic Shell:
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2023 International Symposium on Signals, Circuits and Systems (ISSCS) ,
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A New Time Frequency Based Indicator for Planet Gears Aniso..:
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Mathematics for Human Flourishing in the Time of COVID-19 and Post COVID-19 ,
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