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Communications in Computer and Information Science; HCI International 2022 – Late Breaking Posters ,
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A Study on Software Proposals for Optimization of Augmented..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Pressureless transient liquid phase sintering bonding using..:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Thermomechanical Properties of Fan-Out Wafer Level Package ..:
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Molecular Medical Microbiology ,
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Pathogenesis of trematode infections (blood, liver and lung..:
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2022 IEEE 2nd International Conference on Electronic Technology, Communication and Information (ICETCI) ,
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In-situ Surface Temperature Monitoring through Wafer Temper..:
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Advances in Experimental Medicine and Biology; Digenetic Trematodes ,
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Epidemiology of Trematode Infections: An Update:
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Proceedings of the 2001 international symposium on Low power electronics and design ,
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A 3-pin 1.5 V 550 mW 176 x 144 self-clocked CMOS active pix..:
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2022 28th International Semiconductor Laser Conference (ISLC) ,
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Full-scale exfoliation of InGaN-based light-eMitting diodes..:
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2022 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) ,
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A 260GHz Wireless Transmission over 100m for Beyond 5G Xhau..:
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2021 21st International Conference on Control, Automation and Systems (ICCAS) ,
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Optimized Trajectory Design of an End-Effector-Typed Gait R..:
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Theory and Practice of Natural Computing; Lecture Notes in Computer Science ,
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