Kandlikar, Satish G.
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1

Fundamentals of Heat Dissipation in 3D IC Packaging and The..:

, In: 3D Microelectronic Packaging; Springer Series in Advanced Microelectronics,
Kandlikar, Satish G. ; Ganguly, Amlan - p. 369-395 , 2020
 
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2

CPU cooling with a thermosiphon loop with tapered manifold ..:

, In: 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
 
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3

Flow Boiling in Minichannels and Microchannels:

, In: Heat Transfer and Fluid Flow in Minichannels and Microchannels,
Kandlikar, Satish G. - p. 221-293 , 2014
 
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4

Preface:

, In: Heat Transfer and Fluid Flow in Minichannels and Microchannels,
 
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5

Single-Phase Liquid Flow in Minichannels and Microchannels:

, In: Heat Transfer and Fluid Flow in Minichannels and Microchannels,
Kandlikar, Satish G. - p. 103-174 , 2014
 
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6

Introduction:

, In: Heat Transfer and Fluid Flow in Minichannels and Microchannels,
 
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7

Single-phase liquid flow in minichannels and microchannels:

, In: Heat Transfer and Fluid Flow in Minichannels and Microchannels,
Kandlikar, Satish G. - p. 87-136 , 2006
 
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8

Introduction:

, In: Heat Transfer and Fluid Flow in Minichannels and Microchannels,
 
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9

Preface:

, In: Heat Transfer and Fluid Flow in Minichannels and Microchannels,
 
?
10

Flow boiling in minichannels and microchannels:

, In: Heat Transfer and Fluid Flow in Minichannels and Microchannels,
Kandlikar, Satish G. - p. 175-226 , 2006
 
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11

About the Authors:

, In: Heat Transfer and Fluid Flow in Minichannels and Microchannels,
 
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