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3D Microelectronic Packaging; Springer Series in Advanced Microelectronics ,
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Fundamentals of Heat Dissipation in 3D IC Packaging and The..:
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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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CPU cooling with a thermosiphon loop with tapered manifold ..:
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Heat Transfer and Fluid Flow in Minichannels and Microchannels ,
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Flow Boiling in Minichannels and Microchannels:
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Heat Transfer and Fluid Flow in Minichannels and Microchannels ,
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Single-Phase Liquid Flow in Minichannels and Microchannels:
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Heat Transfer and Fluid Flow in Minichannels and Microchannels ,
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Single-phase liquid flow in minichannels and microchannels:
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Heat Transfer and Fluid Flow in Minichannels and Microchannels ,
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