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2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ,
1
Signal Integrity Design and Analysis of Universal Chiplet I..:
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2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) ,
2
A 39 GHz 2×16-Channel Phased-Array Transceiver IC With Comp..:
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2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) ,
3
Inter-Stream Loopback Calibration for 5G Phased-Array Syste..:
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Proceedings of the 2nd International Conference on Vision, Image and Signal Processing ,
4
Estimating AP Location Using Crowdsourced Wi-Fi Fingerprint..:
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2014 9th European Microwave Integrated Circuit Conference ,
5
Transformer based dual-power-mode CMOS power amplifier for ..:
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2009 European Microwave Conference (EuMC) ,
6
Broadband Class-F Power Amplifiers for Handset Applications:
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2009 European Microwave Conference (EuMC) ,
7
Envelope tracking technique for multimode PA operation:
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2023 IEEE International Solid-State Circuits Conference (ISSCC) ,
8
28.7 A 1.1V 6.4Gb/s/pin 24-Gb DDR5 SDRAM with a Highly-Accu..:
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
9
A 16Gb 27Gb/s/pin T-coil based GDDR6 DRAM with Merged-MUX T..:
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2020 IEEE International Solid- State Circuits Conference - (ISSCC) ,
10
22.2 An 8.5Gb/s/pin 12Gb-LPDDR5 SDRAM with a Hybrid-Bank Ar..:
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2018 IEEE International Solid - State Circuits Conference - (ISSCC) ,
11