Kang, Jin
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1

Process Development of Manifold Microchannels Cooling for E..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yang, Zhou ; Yang, Yuchi ; Lyu, Peijue... - p. 2280-2285 , 2024
 
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3

A 3.75Mb Embedded RRAM IP on 40nm High-Voltage CMOS Technol..:

, In: 2024 IEEE International Memory Workshop (IMW),
He, Yuan ; Ma, Chengxiang ; Ma, Xiangchao... - p. 1-4 , 2024
 
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4

Co-designing new keyboard and mouse solutions with people l..:

, In: Proceedings of the 25th International ACM SIGACCESS Conference on Computers and Accessibility,
 
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5

Playing with Feeling: Exploring Vibrotactile Feedback and A..:

, In: Proceedings of the 25th International ACM SIGACCESS Conference on Computers and Accessibility,
Lu, Leon ; Kang, Jin ; Crispin, Chase. - p. 1-16 , 2023
 
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6

Seed Layer Etching, Thermal Reflow and Bonding of Cu-Sn Mic..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Shi, Yunfan ; Wang, Zilin ; Huang, Rutian... - p. 883-887 , 2023
 
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7

Exploring Rulebook Accessibility and Companionship in Board..:

, In: Proceedings of the 2023 ACM Designing Interactive Systems Conference,
Karim, Saman ; Kang, Jin ; Girouard, Audrey - p. 2221-2232 , 2023
 
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8

First Foundry Platform Demonstration of Hybrid Tunnel FET a..:

, In: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC),
Wang, Kaifeng ; Wu, Yongqin ; Ren, Ye... - p. 13-16 , 2023
 
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9

Physical mechanisms and Enhancement of Endurance Degradatio..:

, In: 2023 Silicon Nanoelectronics Workshop (SNW),
Li, Ruiyi ; Yang, Haozhang ; Zhang, Yizhou... - p. 117-118 , 2023
 
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10

Analyzing the Relationship between Intraday Load Power and ..:

, In: 2023 IEEE 7th Conference on Energy Internet and Energy System Integration (EI2),
Shi, Jiquan ; Kang, Jin ; Wu, Hao... - p. 2057-2061 , 2023
 
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11

A Longitudinal Evaluation of the Impact of a Graduate Stude..:

, In: Proceedings of the 25th Western Canadian Conference on Computing Education,
 
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12

Multi-scale Equivalent Method and Warpage Simulation of Sil..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Feng, Jianyu ; Chen, Chuan ; Hou, Fengze... - p. 1-6 , 2022
 
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13

Analyzing Temperature-Sensitive Loads of Medium Voltage Cla..:

, In: 2022 3rd International Conference on Advanced Electrical and Energy Systems (AEES),
Ma, Xiang ; Kang, Jin ; Wo, Jiandong... - p. 145-151 , 2022
 
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14

Understanding Tabletop Games Accessibility: Exploring Board..:

, In: Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction,
 
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15

Queering E-Therapy: Considerations for the Delivery of Virt..:

, In: Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering; Pervasive Computing Technologies for Healthcare,
 
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