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Kao, Ju-Po
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1

Predicting Clinical Outcome of Stroke Patients with Tractog..:

, In: Brainlesion: Glioma, Multiple Sclerosis, Stroke and Traumatic Brain Injuries; Lecture Notes in Computer Science,
Kao, Po-Yu ; Chen, Jeffereson W. ; Manjunath, B. S. - p. 32-43 , 2020
Link: https://doi.org/10.1007/..
 
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2

Brain Tumor Segmentation and Tractographic Feature Extracti..:

, In: Brainlesion: Glioma, Multiple Sclerosis, Stroke and Traumatic Brain Injuries; Lecture Notes in Computer Science,
Kao, Po-Yu ; Ngo, Thuyen ; Zhang, Angela.. - p. 128-141 , 2019
Link: https://doi.org/10.1007/..
 
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3

Accurate 3D Cell Segmentation Using Deep Features and CRF R..:

, In: 2019 IEEE International Conference on Image Processing (ICIP),
Jiang, Jiaxiang ; Kao, Po-Yu ; Belteton, Samuel A... - p. 1555-1559 , 2019
Link: https://doi.org/10.1109/..
 
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4

Predicting Fluid Intelligence of Children Using T1-Weighted..:

, In: Adolescent Brain Cognitive Development Neurocognitive Prediction; Lecture Notes in Computer Science,
Kao, Po-Yu ; Zhang, Angela ; Goebel, Michael.. - p. 9-16 , 2019
Link: https://doi.org/10.1007/..
 
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5

Feel the pressure : a haptic-feedback device for wearabl..:

, In: Adjunct Proceedings of the 2019 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2019 ACM International Symposium on Wearable Computers,
Biernacki, Jean-Baptiste ; Kao, Po-wen ; Tiruvaipati, Sai Sourabh. - p. 254-256 , 2019
Link: https://dl.acm.org/doi/1..
 
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6

Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packa..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Jay ; Zhang, Zen-Wei ; Lin, Vito... - p. 2107-2111 , 2024
Link: https://doi.org/10.1109/..
 
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7

Air-Coupled Piezoelectric Micromachining Ultrasonic Transdu..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Kao, Chien-Lun ; Hsu, Han-Jen ; Lin, Hsiao-Chi... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

Are You Killing Time? Predicting Smartphone Users' Time-kil..:

, In: Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems,
Chen, Yu-Chun ; Lee, Yu-Jen ; Kao, Kuei-Chun... - p. 1-19 , 2023
Link: https://dl.acm.org/doi/1..
 
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9

High Thermal Solution for 3D Integration Package:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Ching Chia ; Kao, Nicholas ; Wang, Yu Po.. - p. 1026-1029 , 2023
Link: https://doi.org/10.1109/..
 
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10

AC Noise Enhancement with Fan-out Embedded Bride Package So..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Kao, Feng ; Wang, David ; Shih, Teny. - p. 195-198 , 2023
Link: https://doi.org/10.1109/..
 
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11

Innovative Fan-Out Embedded Bridge Structure for Co-Package..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Li, Jay ; Hsu, Terry ; Zhuan, Ming-Han... - p. 228-232 , 2023
Link: https://doi.org/10.1109/..
 
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12

A novel and simple method of low temperature, low process t..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huang, Jeng-Hau ; Shih, Po-Shao ; Shen, Chang-Hsien... - p. 1660-1663 , 2023
Link: https://doi.org/10.1109/..
 
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13

Reduce Size, High Power mmWave Phased-Array Antenna System ..:

, In: 2023 XXXVth General Assembly and Scientific Symposium of the International Union of Radio Science (URSI GASS),
Chang, Su-Wei ; Wu, Jiun-Wei ; Huang, Po-Chia... - p. 1-4 , 2023
Link: https://doi.org/10.23919..
 
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14

The Development of 1.7kV 100A SiC MOSFET Power Module for A..:

, In: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia),
Chiu, Po-Kai ; Lin, Hsin-Han ; Huan, Yuan-Cheng... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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15

Low-Temperature and Pressureless Cu-to-Cu Bonding by Electr..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Shih, Po-Shao ; Huang, Jeng-Hau ; Shen, Chang-Hsien... - p. 579-584 , 2023
Link: https://doi.org/10.1109/..
 
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