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Kao, Yang-Chin
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1

Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Yang, Hung-Chun ; Lai, Wei-Hong ; Kao, Chin-Li.. - p. 151-152 , 2024
Link: https://doi.org/10.23919..
 
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2

Board-Level Drop Reliability Analysis for Fine-Pitch BGA Pa..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),
Lai, Wei-Hong ; Yang, Hung-Chun ; Hsu, Meng-Chi.. - p. 97-100 , 2023
Link: https://doi.org/10.1109/..
 
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3

Post-Buckling Analysis for Addressing Asymmetric Warping of..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chen, Chia-Yu ; Lee, Yu-Ching ; Chen, Kuo-Shen... - p. 265-266 , 2023
Link: https://doi.org/10.23919..
 
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4

Development and Application of the Moisture-Dependent Visco..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Yang, Chia-Ming ; Chiu, Tz-Cheng ; Yin, Wei-Jie... - p. 746-753 , 2022
Link: https://doi.org/10.1109/..
 
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5

Rehabilitate Sustain from Earth to Sea: A Design Study on I..:

, In: HCI International 2021 - Late Breaking Papers: Cognition, Inclusion, Learning, and Culture; Lecture Notes in Computer Science,
Kao, Jui-Yang ; Chang, Shu-Wen ; Yu, Po-Wen. - p. 600-614 , 2021
Link: https://doi.org/10.1007/..
 
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6

From "Cane" to "Sugar": Empowering Taisugar History of Digi..:

, In: Human Aspects of IT for the Aged Population. Design for the Elderly and Technology Acceptance; Lecture Notes in Computer Science,
Lin, Yang-Chin ; Kao, Jui-Yang ; Tsai, Wang-Chin - p. 431-440 , 2019
Link: https://doi.org/10.1007/..
 
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7

Single-Photon-Emission Computed Tomography Studies with Dop..:

, In: Neuropathology of Drug Addictions and Substance Misuse,
Lin, Shih-Hsien ; Chen, Kao Chin ; Yang, Yen Kuang - p. 966-973 , 2016
Link: https://doi.org/10.1016/..
 
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8

Leveraging Auxiliary Information from EMR for Weakly Superv..:

, In: Medical Image Computing and Computer Assisted Intervention – MICCAI 2021; Lecture Notes in Computer Science,
Yang, Hao-Hsiang ; Wang, Fu-En ; Sun, Cheng... - p. 251-261 , 2021
Link: https://doi.org/10.1007/..
 
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9

Toward Free Head Motion for Visible-Spectrum Gaze Tracking ..:

, In: 2021 IEEE International Conference on Consumer Electronics (ICCE),
Kao, Wen-Chung ; Cheng, Pei-Ting ; Chiu, Yi-Chin... - p. 1-2 , 2021
Link: https://doi.org/10.1109/..
 
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10

Quality Evaluation via PPG on the AVFs of Hemodialysis Pati..:

, In: 2019 IEEE SENSORS,
Chiang, Pei-Yu ; Chao, Paul C.-P. ; Tu, Tse-Yi... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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11

A Chinese Oral Question-and-Answering System Based on LSTM:

, In: 2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW),
Chen, Kuan-Hung ; Kao, Jui-I ; Wu, Chia-Hung.. - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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12

A cooperative MAC protocol in multi-channel wireless ad hoc..:

, In: 2011 7th International Wireless Communications and Mobile Computing Conference,
Shih, Tsung-Chin ; Kao, Chien-Chi ; Yang, Shun-Ren - p. 1831-1836 , 2011
Link: https://doi.org/10.1109/..
 
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13

Optimal Broadcast in All-Port Wormhole-Routed Hypercubes:

, In: 1994 International Conference on Parallel Processing Vol. 3,
Ching-Tien Ho, Ching-Tien Ho ; Ming-Yang Kao, Ming-Yang Kao - p. None , 1994
Link: https://doi.org/10.1109/..
 
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14

Solder Joint Reliability Comparison Under JEDEC Drop and Sy..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Shih, Meng-Kai ; Ke, Zih-Jun ; Yen, Chun-Yu.. - p. 153-154 , 2024
Link: https://doi.org/10.23919..
 
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15

High Acceleration Dynamic Methodology for Board-Level Shock..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yu, Min-Cheng ; Wu, Nan-Yi ; Wang, Wu-Lung... - p. 1213-1218 , 2024
Link: https://doi.org/10.1109/..
 
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