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Kawakami, Shogo
1
results:
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1
Fatigue strength of through hole in printed circuit board:
, In:
2014 International Conference on Electronics Packaging (ICEP)
,
Iwade, Shogo
;
Kinoshita, Takahiro
;
Kawakami, Takashi
.. - p. 517-520 , 2014
Link:
https://doi.org/10.1109/..
1-1
