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Ke, Ying-Tzu
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1

A Hybrid Buck Converter Stacked on Auxiliary-switched-capac..:

, In: ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC),
Wu, Tzu-Ying ; Shi-Jun, Zeng ; Wang, Tz-Wun... - p. 429-432 , 2023
Link: https://doi.org/10.1109/..
 
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2

20.4 Multiple-Phase Accelerated Current Control in Bidirect..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Wang, Tz-Wun ; Li, Si-Yi ; Hung, Sheng-Hsi... - p. 308-310 , 2023
Link: https://doi.org/10.1109/..
 
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3

Triple Binary SAR Control in Distributive Digital Low Dropo..:

, In: 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
Wu, Bo-Kuan ; Wu, Tzu-Ying ; Lee, Sheng Cheng... - p. 2919-2922 , 2022
Link: https://doi.org/10.1109/..
 
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4

A Monolithic GaN-Based Driver and GaN Power HEMT with Diode..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Kao, Yu-Yung ; Wang, Tz-Wun ; Hung, Sheng-Hsi... - p. 228-230 , 2022
Link: https://doi.org/10.1109/..
 
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5

A Dual-Mode Seamless Transition Low-Dropout Regulator with ..:

, In: 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
Tzeng, Tzu-Yu ; Lee, Sheng Cheng ; Chen, Ke-Horng... - p. 3058-3062 , 2022
Link: https://doi.org/10.1109/..
 
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6

A Pre-Charge Tracking Technique in the 40MHz High-switching..:

, In: ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC),
Yang, Tzu-Hsien ; Chiu, Chun-Kai ; Wen, Yong-Hwa... - p. 311-314 , 2021
Link: https://doi.org/10.1109/..
 
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7

Embracing Stigma? Finding Workplace Dignity in Dirty Work:

, In: The Palgrave Handbook of Fulfillment, Wellness, and Personal Growth at Work,
Chang, Ariana ; Lin, Ying-Tzu - p. 355-370 , 2023
Link: https://doi.org/10.1007/..
 
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8

Perceiving the Ukraine-Russia Conflict: Topic Modeling and ..:

, In: 2023 IEEE Ninth International Conference on Big Data Computing Service and Applications (BigDataService),
Chang, Philip ; Yu, Ying-Tzu ; Sanders, Abraham. - p. 147-148 , 2023
Link: https://doi.org/10.1109/..
 
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9

The Development and Performance of InGaP/GaAs Single-Quantu..:

, In: 2022 Asia Communications and Photonics Conference (ACP),
Cheng, Sheng-Wen ; Chen, Ying-Tzu ; Kumar, Mukul. - p. 1472-1474 , 2022
Link: https://doi.org/10.1109/..
 
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10

Monolithically Integrated Optoelectronic Multiplexer Circui..:

, In: 2021 Opto-Electronics and Communications Conference (OECC),
Chen, Ying-Tzu ; Liang, Ya-Ting ; Wu, Chao-Hsin - p. 1-3 , 2021
Link: https://doi.org/10.1364/..
 
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11

Fabrication and Characterization of Wafer Level Three-Dimen..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hung, Ying-Tzu ; Chang, Hsiang-Hung ; Huang, Jian-Zhi. - p. 125-128 , 2020
Link: https://doi.org/10.1109/..
 
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12

Application of PBL in ERP Textbook Design and Technical Uni..:

, In: 2020 IEEE Global Engineering Education Conference (EDUCON),
May, Ming-Der ; Lin, Hsiang-Yuan ; Tseng, Ying-Tzu. - p. 878-884 , 2020
Link: https://doi.org/10.1109/..
 
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13

SPD-YOLOv7: A New Method for Corn Pest Detection:

, In: 2024 IEEE 4th International Conference on Electronic Technology, Communication and Information (ICETCI),
Xu, Shipeng ; Huang, Zishen ; Cheng, Tzu-Ying. - p. 1345-1348 , 2024
Link: https://doi.org/10.1109/..
 
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14

Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsu, Mu-Ping ; Tsai, Wen-Tsu ; Lee, Ou-Hsiang... - p. 2131-2135 , 2024
Link: https://doi.org/10.1109/..
 
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15

Using Patent Mining to Explore the Impacts of Patent Intens..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Chen, Deng-Neng ; Lai, Chia-Yu ; Yang, Tzu-Ying. - p. 71-72 , 2023
Link: https://doi.org/10.1109/..
 
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