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Keqing Yan
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1

Accurate 3DIC thermal simulation for BEOL influence study:

, In: 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA),
Yang, Hao ; Yan, Bin ; Sur, Jianjun... - p. 17-19 , 2022
Link: https://doi.org/10.1109/..
 
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2

A Modularized Thermal Test Chip Design and Verification:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Sun, Jianjun ; Wang, Deping ; Zhou, Shiying... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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3

Thermal Resistance Simulation Analysis and Test Research of..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Qu, Fang ; Yan, Bin ; Wang, Zongwei... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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4

A Quantitative Analysis Model of Flow Induced Vibration Noi..:

, In: 2022 Asia Communications and Photonics Conference (ACP),
Zhang, Keqing ; Xiao, Xiangpeng ; Yan, Baoqiang... - p. 2048-2051 , 2022
Link: https://doi.org/10.1109/..
 
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5

Self-training with Masked Supervised Contrastive Loss for U..:

, In: 2021 International Joint Conference on Neural Networks (IJCNN),
Liu, Zijun ; Yan, Yuanmeng ; He, Keqing... - p. 1-7 , 2021
Link: https://doi.org/10.1109/..
 
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6

Adversarial Cross-Lingual Transfer Learning for Slot Taggin..:

, In: 2020 International Joint Conference on Neural Networks (IJCNN),
He, Keqing ; Yan, Yuanmeng ; Xu, Weiran - p. 1-8 , 2020
Link: https://doi.org/10.1109/..
 
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7

Learning Label-Relational Output Structure for Adaptive Seq..:

, In: 2020 International Joint Conference on Neural Networks (IJCNN),
He, Keqing ; Yan, Yuanmeng ; Xu, Hong... - p. 1-8 , 2020
Link: https://doi.org/10.1109/..
 
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