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Kiat Goh, Simon Chun
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1

Design and Fabrication of 2.5D Cryogenic Interposer With In..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, HongYu ; Chui, King-Jien ; Kiat Goh, Simon Chun... - p. 458-463 , 2024
Link: https://doi.org/10.1109/..
 
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2

Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bond..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Kiat Goh, Simon Chun ; Hemanth Kumar, Cheemalamarri ; Hu, Liangxing... - p. 404-408 , 2023
Link: https://doi.org/10.1109/..
 
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3

A Precise Wafer Thinning Integration Process for nano-TSV F..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Tseng, Ya-Ching ; Kiat Goh, Simon Chun ; Darshini, Senthilkumar... - p. 1170-1174 , 2023
Link: https://doi.org/10.1109/..
 
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4

Comparative Study of Die-Attach Materials for LED Die Bondi..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Hu, Liangxing ; Bao, Shuyu ; Wang, Yue... - p. 447-451 , 2022
Link: https://doi.org/10.1109/..
 
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5

A Wafer Scale Hybrid Integration Platform for Co-packaged P..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Venkatesan, Suresh ; Lee, James ; Kiat Goh, Simon Chun... - p. 381-382 , 2022
Link: https://doi.org/10.1109/..
 
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6

Mid Infrared Volatile Compounds Detection Using Thermally R..:

, In: 2019 IEEE SENSORS,
Kiat Goh, Simon Chun ; Chuan, KaiLiang ; Lee, Chengkuo. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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7

Electrical Characterization and Reliability Studies of Nano..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Tseng, Ya-Ching ; Chui, King-Jien ; Goh, Simon Chun Kiat... - p. 1581-1586 , 2024
Link: https://doi.org/10.1109/..
 
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8

2.5D Technology based on Vertically Aligned Carbon Nanotube..:

, In: 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023,
Chun Kiat Goh, Simon ; Fei Siah, Chun ; De Saxce, Joseph... - p. 767-770 , 2023
Link: https://doi.org/10.1109/..
 
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9

Plasma-Activated Cu-Cu and Al-Al Direct Bonding for Electro..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hu, Liangxing ; Goh, Simon Chun Kiat ; Lim, Yu Dian... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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10

Process Development and Integration on Si Substrate for Ion..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Li, H. Y. ; Liu Huihong, Clarence ; Jaafar, Norhanani... - p. 253-256 , 2023
Link: https://doi.org/10.1109/..
 
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