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Kim, Boo-Young
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1

2.4 ATOMUS: A 5nm 32TFLOPS/128TOPS ML System-on-Chip for La..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Yu, Chang-Hyo ; Kim, Hyo-Eun ; Shin, Sungho... - p. 42-44 , 2024
Link: https://doi.org/10.1109/..
 
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2

LightTrader : World's first AI-enabled High-Frequency Tradi..:

, In: 2022 IEEE Hot Chips 34 Symposium (HCS),
Kim, Hyunsung ; Yoo, Sungyeob ; Bae, Jaewan... - p. 1-10 , 2022
Link: https://doi.org/10.1109/..
 
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3

A 1Gb/s Optical Transceiver Array Chipset for Automotive Wi..:

, In: 2007 IEEE International Symposium on Circuits and Systems (ISCAS),
Choi, Boo-Young ; Han, J.-W. ; Park, S. M.... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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4

4-b true time-delay feeder using MEMS switches for linear p..:

, In: Optical Fiber Communication Conference and Exhibit,
Gab-Yong Lee ; Yeon-Bong Choi ; Jong-Dug Shin. - p. 738,739,740 , 2002
Link: https://doi.org/10.1109/..
 
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5

Orbital-Scale Paleoceanographic Response to the Indian Mons..:

, In: Patterns and Mechanisms of Climate, Paleoclimate and Paleoenvironmental Changes from Low-Latitude Regions; Advances in Science, Technology & Innovation,
Khim, Boo-Keun ; Kim, Ji-Eun ; Horikawa, Keiji... - p. 9-11 , 2019
Link: https://doi.org/10.1007/..
 
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6

A Retransmission Method for Improving Transmission Reliabil..:

, In: Proceedings of the 2017 the 7th International Conference on Communication and Network Security,
Jeon, Boo-Sun ; Huh, Young-Jun ; Na, Jung-Chan - p. 109-113 , 2017
Link: https://dl.acm.org/doi/1..
 
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7

Board Level Drop Reliability of Hybrid Solder Joints with C..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kim, Seahwan ; Min, Kyung Deuk ; Jun Yoon, Jae.. - p. 1473-1478 , 2024
Link: https://doi.org/10.1109/..
 
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8

Development of Load Optimization and Anomaly Detection Plat..:

, In: Lecture Notes in Computer Science; Human-Computer Interaction,
Cha, Ji-hyun ; Jeong, Heung-gyun ; Han, Seung-woo... - p. 3-14 , 2024
Link: https://doi.org/10.1007/..
 
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9

Heat Dissipation Characteristics of Cu-MWNT Nanocomposites ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Jeong, Geon-Joo ; Kim, Tae-Yoo ; Jung, Seung-Boo. - p. 337-338 , 2024
Link: https://doi.org/10.23919..
 
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10

Enhancement of Ga - 21.5 In - 10 Sn Eutectic Alloy Based Th..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kim, Jang Baeg ; Kang, Dong Gil ; Noh, Taejoon.. - p. 1730-1734 , 2023
Link: https://doi.org/10.1109/..
 
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11

The transient liquid phase bonding by ultrasonic-assisted s..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Kim, Kyung-Yeol ; Ha, Eun ; Noh, Taejoon. - p. 39-40 , 2022
Link: https://doi.org/10.23919..
 
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12

RF Characterization in Range of 18GHz in Fan-out Package St..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ha, Eun ; Jeong, Haksan ; Min, Kyung Deuk.. - p. 2002-2007 , 2022
Link: https://doi.org/10.1109/..
 
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13

Mechanical properties and microstructures of Cu/In-48Sn all..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kang, Dong Gil ; Deuk Min, Kyung ; Jung, Hak San... - p. 2206-2210 , 2022
Link: https://doi.org/10.1109/..
 
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14

Environmental Reliability Evaluation of the Ultrasonic Bond..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Noh, Taejoon ; Kim, Kyung-Yeol ; Kang, Dong-Gil. - p. 51-52 , 2022
Link: https://doi.org/10.23919..
 
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15

Pressureless transient liquid phase sintering bonding using..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Hwang, Byeong-Uk ; Min, Kyung Deuk ; Jung, Kwang-Ho... - p. 1855-1860 , 2020
Link: https://doi.org/10.1109/..
 
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