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Kim, I.K.
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1

Interdiffusion in the pinned electrode of the exchanged-bia..:

, In: IEEE International Digest of Technical Papers on Magnetics Conference,
Lee, J.H. ; Rho, I.C. ; Jeong, H.D.... - p. DE10 , 2002
Link: https://doi.org/10.1109/..
 
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2

Learning-based approach for license plate recognition:

, In: Neural Networks for Signal Processing X. Proceedings of the 2000 IEEE Signal Processing Society Workshop (Cat. No.00TH8501),
Kim, K.K. ; Kim, K.I. ; Kim, J.B.. - p. 614,615,616,617,618,619,620,621,622,623 , 2000
Link: https://doi.org/10.1109/..
 
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3

The Unconstrained Ear Recognition Challenge 2019:

, In: 2019 International Conference on Biometrics (ICB),
Emersic, Z. ; Park, H. J. ; Nam, G. P.... - p. 1-15 , 2019
Link: https://doi.org/10.1109/..
 
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4

Enhanced Anti-stokes Luminescence via Acoustic to Optical P..:

, In: 2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring),
Hossen, R. ; Hwang, H. Y. ; Kim, I.... - p. 3817-3822 , 2019
Link: https://doi.org/10.1109/..
 
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5

Non-rigid Temporal Alignment of 2D and 3D Multi-channel Mic..:

, In: Bildverarbeitung für die Medizin 2007; Informatik aktuell,
Kim, I. ; Yang, S. ; Le Baccon, P.... - p. 16-20 , 2007
Link: https://doi.org/10.1007/..
 
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6

Novel Heat Dissipating Cell Scheme for Improving a Reset Di..:

, In: 2007 IEEE Symposium on VLSI Technology,
Kang, D.H. ; Yu, J. ; Kong, J.H.... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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7

Highly Reliable 256Mb PRAM with Advanced Ring Contact Techn..:

, In: 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers.,
Song, Y.J. ; Kong, J. ; Ahn, S.... - p. 118-119 , 2006
Link: https://doi.org/10.1109/..
 
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8

An analytic treatment for radial density profiles of a larg..:

, In: IEEE Conference Record - Abstracts. 1997 IEEE International Conference on Plasma Science,
Chung, K.-S. ; Hwang, S.M. ; Kim, G.H.... - p. 153 , 1997
Link: https://doi.org/10.1109/..
 
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9

Estimation of absorbed fraction for Ac-225 targeted alpha t..:

, In: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD),
Muath, A.-M. ; Yang, J. ; Kim, K... - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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10

Ongoing Evolution of DRAM Scaling via Third Dimension -Vert..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Han, J.W. ; Park, S.H. ; Jeong, M.Y.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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11

28nm CIS-Compatible Embedded STT-MRAM for Frame Buffer Memo..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Lee, K. ; Kim, D. S. ; Bak, J. H.... - p. 2.1.1-2.1.4 , 2021
Link: https://doi.org/10.1109/..
 
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12

1Gbit High Density Embedded STT-MRAM in 28nm FDSOI Technolo..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Lee, K. ; Kim, W. J. ; Lee, J. H.... - p. 2.2.1-2.2.4 , 2019
Link: https://doi.org/10.1109/..
 
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13

A novel integration of STT-MRAM for on-chip hybrid memory b..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Park, J.-H. ; Lee, J. ; Jeong, J.... - p. 2.5.1-2.5.4 , 2019
Link: https://doi.org/10.1109/..
 
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14

List of contributors:

, In: 3D Bioprinting for Reconstructive Surgery,
Abelardo, E. ; Al-Sabah, A. ; Chae, M.P.... - p. xi-xiii , 2018
Link: https://doi.org/10.1016/..
 
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15

Si FinFET based 10nm technology with multi Vt gate stack fo..:

, In: 2016 IEEE Symposium on VLSI Technology,
Cho, H.-J. ; Oh, H.S. ; Nam, K.J.... - p. 1-2 , 2016
Link: https://doi.org/10.1109/..
 
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