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Kim, Joonsung
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1

3D-FPIM: An Extreme Energy-Efficient DNN Acceleration Syste..:

, In: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO),
Lee, Hunjun ; Kim, Minseop ; Min, Dongmoon... - p. 1359-1376 , 2022
Link: https://doi.org/10.1109/..
 
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2

UC-Check: Characterizing Micro-operation Caches in x86 Proc..:

, In: MICRO-54: 54th Annual IEEE/ACM International Symposium on Microarchitecture,
Kim, Joonsung ; Jang, Hamin ; Lee, Hunjun.. - p. 550-564 , 2021
Link: https://dl.acm.org/doi/1..
 
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3

Contributors:

, In: Opportunities for Fluoropolymers,
Aktas Eken, Gozde ; Asandei, Alexandru D. ; Beuermann, Sabine... - p. xi-xiii , 2020
Link: https://doi.org/10.1016/..
 
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4

Specifics of the Mn2(CO)10 photomediated synthesis of PVDF ..:

, In: Opportunities for Fluoropolymers,
Vasu, Vignesh ; Kim, Joon-Sung ; Dutta, Abhirup. - p. 89-112 , 2020
Link: https://doi.org/10.1016/..
 
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5

Enforcing Last-Level Cache Partitioning through Memory Virt..:

, In: 2019 28th International Conference on Parallel Architectures and Compilation Techniques (PACT),
Chung, Jongwook ; Ro, Yuhwan ; Kim, Joonsung... - p. 97-109 , 2019
Link: https://doi.org/10.1109/..
 
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6

MnnFast : a fast and scalable system architecture for me..:

, In: Proceedings of the 46th International Symposium on Computer Architecture,
Jang, Hanhwi ; Kim, Joonsung ; Jo, Jae-Eon.. - p. 250-263 , 2019
Link: https://dl.acm.org/doi/1..
 
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7

μLayer : Low Latency On-Device Inference Using Cooperati..:

, In: Proceedings of the Fourteenth EuroSys Conference 2019,
Kim, Youngsok ; Kim, Joonsung ; Chae, Dongju.. - p. 1-15 , 2019
Link: https://dl.acm.org/doi/1..
 
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8

FIDR : A Scalable Storage System for Fine-Grain Inline D..:

, In: Proceedings of the 52nd Annual IEEE/ACM International Symposium on Microarchitecture,
Ajdari, Mohammadamin ; Lee, Wonsik ; Park, Pyeongsu.. - p. 239-252 , 2019
Link: https://dl.acm.org/doi/1..
 
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9

SSDcheck : timely and accurate prediction of irregular b..:

, In: Proceedings of the 51st Annual IEEE/ACM International Symposium on Microarchitecture,
Kim, Joonsung ; Park, Pyeongsu ; Ahn, Jaehyung... - p. 455-468 , 2018
Link: https://dl.acm.org/doi/1..
 
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10

CloudSwap : a cloud-assisted swap mechanism for mobile d..:

, In: Proceedings of the 16th IEEE/ACM International Symposium on Cluster, Cloud, and Grid Computing,
Chae, Dongju ; Kim, Joonsung ; Kim, Youngsok... - p. 462-472 , 2016
Link: https://dl.acm.org/doi/1..
 
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11

VSCHH 2023: A Benchmark for the View Synthesis Challenge of..:

, In: 2023 IEEE/CVF International Conference on Computer Vision Workshops (ICCVW),
Jang, Youngkyoon ; Zheng, Jiali ; Song, Jifei... - p. 1113-1120 , 2023
Link: https://doi.org/10.1109/..
 
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12

Process Improvements for 7th Generation 1Tb Quad-Level Cell..:

, In: 2023 IEEE International Memory Workshop (IMW),
Chung, Soochan ; Ko, Dong-Hyeon ; Lim, Joonsung... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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13

PIE-DRAM: Postponing IECC to Enhance DRAM performance with ..:

, In: 2023 60th ACM/IEEE Design Automation Conference (DAC),
Jeon, JaeHwa ; Hong, Jae-Youn ; Kim, Sunghoon.. - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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14

High Bit Cost Scalability and Reliable Cell Characteristics..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Kim, Kyungmoon ; Seo, Yujeong ; Park, Sejun... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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15

A Miniaturized Wireless Neural Implant with Body-Coupled Da..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Lee, Changuk ; Kim, Byeongseol ; Kim, Jejung... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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