Kim, Min-Hyung
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2

Urban form, the use of ICT and smart cities in Vietnam:

, In: Smart Cities for Technological and Social Innovation,
 
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3

Autonomous vehicles and smart cities: A case study of Singa..:

, In: Smart Cities for Technological and Social Innovation,
Ng, Vincent ; Kim, Hyung Min - p. 265-287 , 2021
 
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4

Contributors:

, In: Smart Cities for Technological and Social Innovation,
Albornoz, Camila ; Barrett, Brendan F.D. ; Chen, Yiqun... - p. xiii-xiv , 2021
 
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5

Smart cities beyond COVID-19:

, In: Smart Cities for Technological and Social Innovation,
Kim, Hyung Min - p. 299-308 , 2021
 
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6

Diversified development paths of smart cities:

, In: Smart Cities for Technological and Social Innovation,
Kim, Hyung Min ; Kent, Anthony - p. 289-297 , 2021
 
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7

State-of-the-art of Korean smart cities: A critical review ..:

, In: Smart Cities for Technological and Social Innovation,
Choi, Junyoung ; Kim, Hyung Min - p. 51-72 , 2021
 
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8

Smart cities as a platform for technological and social inn..:

, In: Smart Cities for Technological and Social Innovation,
 
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10

Manufacturing and Logistics Networks of Korean Firms in Chi..:

, In: Advances in Logistics, Operations, and Management Science; Managerial Strategies and Practice in the Asian Business Sector,
Liu, Zheng ; Kim, Hyung Min ; Zhang, Kaifeng - p. 193-219 , 2016
 
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11

International real estate investments: issues and research ..:

, In: A Research Agenda for Real Estate,
Min Kim, Hyung - p. 203-223 , 2022
 
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12

13.2 A 32Gb 8.0Gb/s/pin DDR5 SDRAM with a Symmetric-Mosaic ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Choi, Ikjoon ; Hong, Seunghwan ; Kim, Kihyun... - p. 234-236 , 2024
 
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13

An Efficient Ku-Band Two-Way Vertical-like Power-Combining ..:

, In: 2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC),
Kim, Joon-Hyung ; Lim, Jeong-Taek ; Lee, Jae-Eun... - p. 299-302 , 2024
 
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14

High-Performance Broadband CMOS Low-Noise Amplifier with a ..:

, In: 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC),
Kim, Joon-Hyung ; Son, Jeong-Taek ; Lim, Jung-Taek... - p. 125-128 , 2023
 
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15

2.5D Large-Scale Interposer Bonding Process Verification us..:

, In: 2023 International Conference on Electronics, Information, and Communication (ICEIC),
 
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