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Kim, Woolchul
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1
Effective Thermal Solution via Wafer Level Packaging Materi..:
, In:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
,
Kim, Junghwa
;
Na, Wool-Chul
;
Kim, JungSeob
... - p. 2013-2018 , 2020
Link:
https://doi.org/10.1109/..
1-1
