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Koh, Shao Ming
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1

Considerations in Determining Human-Robot Ratio:

, In: Companion of the 2020 ACM/IEEE International Conference on Human-Robot Interaction,
Koh, Danny Shu Ming ; Ong, Hiok Hian ; Lee, Kok Hoo.. - p. 308-310 , 2020
Link: https://dl.acm.org/doi/1..
 
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2

Team Cognitive Walkthrough: Fusing Creativity and Effective..:

, In: Advances in Intelligent Systems and Computing; Proceedings of the 20th Congress of the International Ergonomics Association (IEA 2018),
Lee, Kok Hoo ; Chua, Kenny Wei Liang ; Koh, Danny Shu Ming. - p. 117-126 , 2018
Link: https://doi.org/10.1007/..
 
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3

An Automated Data Processing Pipeline for Coral Reef Monito..:

, In: OCEANS 2022, Hampton Roads,
Sui, Yee Wang ; Ming, Koh Xian ; Meghjani, Malika... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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4

Centroid-amenities : an interactive visual analytical to..:

, In: Proceedings of the 26th ACM SIGSPATIAL International Conference on Advances in Geographic Information Systems,
Qian, Jazreel Siew Xue ; Ming, Sean Koh Jia - p. 616-617 , 2018
Link: https://dl.acm.org/doi/1..
 
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5

Contributors:

, In: Circularity of Plastics,
Chai, Casandra Hui Teng ; Chan, Chui Yu ; Chen, Guo-Qiang... - p. xi-xiii , 2023
Link: https://doi.org/10.1016/..
 
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6

Scalable Block-Based Spiking Neural Network Hardware with a..:

, In: 2020 IEEE International Symposium on Circuits and Systems (ISCAS),
Nambiar, Vishnu P. ; Koh, Eng Kiat ; Pu, Junran... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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7

Synthesis of Photocatalytic Iron(III) Fumarate Metal Organi..:

, In: IRC-SET 2020,
Neo, Shao Jun ; Koh, Keith ; Low, Wei Sheng - p. 651-662 , 2021
Link: https://doi.org/10.1007/..
 
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8

List of Contributors:

, In: Sprouted Grains,
Ayele, Belay T. ; Brovelli, Vanessa ; Chan, Chak-Lun... - p. xi-xiii , 2019
Link: https://doi.org/10.1016/..
 
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9

Gamma-aminobutyric acid:

, In: Sprouted Grains,
Chua, Jian-Yong ; Koh, Matthew Kok Ping ; Liu, Shao-Quan - p. 25-54 , 2019
Link: https://doi.org/10.1016/..
 
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10

Fan-Out Wafer-Level Packaging for Heterogeneous Integration:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Li, Zhang ; Tan, Kim Hwee... - p. 2360-2366 , 2018
Link: https://doi.org/10.1109/..
 
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11

Reliability of Fan-Out Wafer-Level Packaging with Large Chi..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Lau, John ; Kuah, Eric ; Li, Zhang... - p. 1574-1582 , 2018
Link: https://doi.org/10.1109/..
 
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12

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous ..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Ko, Cheng-Ta ; Chang, Chieh-Lin ; Pan, Jhih-Yuan... - p. 355-363 , 2018
Link: https://doi.org/10.1109/..
 
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13

Stencil printing of underfill for flip chips on organic-pan..:

, In: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC),
Lau, John H. ; Zhang, Qinglong ; Li, Ming... - p. 168-174 , 2015
Link: https://doi.org/10.1109/..
 
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14

Contributing Authors:

, In: Tumors of the Spine,
Belknap, Thomas W. ; Bilsky, Mark H. ; Chang, Jae-Chil... - p. ix-x , 2008
Link: https://doi.org/10.1016/..
 
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15

Gate-all-around Twin Silicon nanowire SONOS Memory:

, In: 2007 IEEE Symposium on VLSI Technology,
Suk, Sung Dae ; Yeo, Kyoung Hwan ; Cho, Keun Hwi... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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