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IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. ,
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Fabrication of 3D trench PZT capacitors for 256Mbit FRAM de..:
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Proceedings of the 2020 The 9th International Conference on Informatics, Environment, Energy and Applications ,
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Heat Transfer Characteristics in a Plate-Fin Heat Exchanger..:
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2016 18th International Conference on Advanced Communication Technology (ICACT) ,
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Abnormal traffic filtering mechanism for protecting ICS net..:
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Proceedings of the 2007 ACM symposium on Applied computing ,
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Memory-efficient content filtering hardware for high-speed ..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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A Low-Voltage Area-Efficient TSV I/O for HBM with Data Rate..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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A Low Power TSV I/O with Data Rate up to 10 Gb/s for Next G..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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13.10 A 4nm 48Gb/s/wire Single-Ended NRZ Parallel Transceiv..:
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2023 IEEE International Solid- State Circuits Conference (ISSCC) ,
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A 4nm 32Gb/s 8Tb/s/mm Die-to-Die Chiplet Using NRZ Single-E..:
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2020 IEEE Wireless Communications and Networking Conference Workshops (WCNCW) ,
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Demo: In-Vessel Molecular MIMO Communications:
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ICC 2020 - 2020 IEEE International Conference on Communications (ICC) ,
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Deep Learning-based Human Implantable Nano Molecular Commun..:
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Bio-inspired Information and Communication Technologies; Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering ,
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Molecular MIMO Communications Platform with BTSK for In-Ves..:
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The 10th International Conference on Future Internet ,
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Comparative Study of Content-Centric vs. Content Delivery N..:
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Proceedings of the 21st Annual International Conference on Mobile Computing and Networking ,
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Demo : Molecular MIMO with Drift:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
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