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Koyanagi, Mitsumasa
18  results:
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1

Impact of Super-long-throw PVD on TSV Metallization and Die..:

, In: 2023 IEEE International 3D Systems Integration Conference (3DIC),
Shen, Jiayi ; Liu, Chang ; Hoshi, Tadaaki... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

Tight-Pitched 10 μm-Width Solder Joints for c-2-c and c-2-w..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Mariappan, Murugesan ; Fukuzumi, Shizu ; Shibata, Tomoaki... - p. 1138-1143 , 2022
Link: https://doi.org/10.1109/..
 
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3

Comprehensive Study on Advanced Chip on Wafer Hybrid Bondin..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Shirasaka, Toshiaki ; Okuda, Tadashi ; Shibata, Tomoaki... - p. 317-323 , 2022
Link: https://doi.org/10.1109/..
 
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4

System Integration Technology Based on 3D Integration:

, In: 2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK),
Koyanagi, Mitsumasa - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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5

Optogenetic Potentials of Diverse Animal Opsins: Parapinops..:

, In: Advances in Experimental Medicine and Biology; Optogenetics,
Koyanagi, Mitsumasa ; Saito, Tomoka ; Wada, Seiji... - p. 141-151 , 2021
Link: https://doi.org/10.1007/..
 
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6

Impact of Electroless-Ni Seed Layer on Cu-Bottom-up Electro..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Mariappan, Murugesan ; Koyanagi, Mitsumasa ; Fukushima, Takafumi - p. 1736-1741 , 2020
Link: https://doi.org/10.1109/..
 
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7

3D Heterogeneous Integration Technology for AI System:

, In: 2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT),
Koyanagi, Mitsumasa - p. 1-1 , 2020
Link: https://doi.org/10.1109/..
 
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8

3D Heterogeneous Integration Technology for Al System:

, In: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Koyanagi, Mitsumasa - p. 11-11 , 2020
Link: https://doi.org/10.1109/..
 
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9

Tight-Pitch Au-Sn Interconnections for 3D-ICs Integration a..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Mariappan, Murugesan ; Koyanagi, Mitsumasa ; Fukushima, Takafumi - p. 1448-1452 , 2020
Link: https://doi.org/10.1109/..
 
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10

Fabrication and Morphological Characterization of Nano-Scal..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Mariappan, Murugesan ; Koyanagi, Mitsumasa ; Hashimoto, Hiroyuki.. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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11

Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integ..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Kurooka, Shunji ; Hotta, Yoshinori ; Nakamura, Ai.. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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12

Growth Optimization of Multi-Layer Graphene for Thermal-TSV..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Mariappan, Murugesan ; Koyanagi, Mitsumasa ; Fukushima, Takafumi - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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13

Connectivity in Electronic Packaging:

, In: VLSI Design and Test for Systems Dependability,
Ishikuro, Hiroki ; Kuroda, Tadahiro ; Kosuge, Atsutake... - p. 325-350 , 2018
Link: https://doi.org/10.1007/..
 
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14

A 3D-VLSI Architecture for Future Automotive Visual Recogni..:

, In: VLSI Design and Test for Systems Dependability,
Koyanagi, Mitsumasa ; Kobayashi, Hiroaki ; Aoki, Takafumi.. - p. 719-733 , 2018
Link: https://doi.org/10.1007/..
 
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15

Feasibility study of Cu paste printing technique to fill de..:

, In: 2017 IEEE International Interconnect Technology Conference (IITC),
Hoang, Tri Hai ; Lee, Kang-Wook ; Ando, Daisuke... - p. 1-3 , 2017
Link: https://doi.org/10.1109/..
 
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