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Kuo, Chun-Liang
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1

Study on Enhancing Flip-Chip-Chip Scale Package (FCCSP) Rel..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Nair, Arya Sukumaran ; Djuric-Rissner, Tatjana ; Hoffrogge, Peter... - p. 952-960 , 2023
Link: https://doi.org/10.1109/..
 
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2

Reliability Prediction and Improvement of Board-Level Therm..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Dao-Long ; Chen, Tang-Yuan ; Lai, Wei-Hong... - p. 995-998 , 2023
Link: https://doi.org/10.1109/..
 
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3

A Study of JEDEC Board-Level Drop Test Performance Predicti..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Cheng, Chi-Min ; Chao, Hsi-Wei ; Yen, Chu-Chiao... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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4

Bandwidth constrained routing problem in multi-hop wireless..:

, In: Proceedings of the 9th ACM international symposium on Modeling analysis and simulation of wireless and mobile systems,
Chiu, Chun-Yuan ; Kuo, Yu-Liang ; Wu, Hsiao-Kuang. - p. 365-369 , 2006
Link: https://dl.acm.org/doi/1..
 
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5

Advanced Fanout Packaging Technology for Hybrid Substrate I..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Lee, Teck Chong ; Chen, Rick... - p. 1362-1370 , 2022
Link: https://doi.org/10.1109/..
 
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6

Tracers placement for IP traceback against DDoS attacks:

, In: Proceedings of the 2006 international conference on Wireless communications and mobile computing,
Wang, Chun-Hsin ; Yu, Chang-Wu ; Liang, Chiu-Kuo... - p. 355-360 , 2006
Link: https://dl.acm.org/doi/1..
 
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7

Determinants of Intelligent Logistics of iBox in Taiwan: A ..:

, In: 2024 IEEE International Conference on Consumer Electronics (ICCE),
You, Chun-Ting ; Chen, Liang-Bi ; Kuo, Szu-Yu - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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8

Layout Guidelines against Charging Damage from the Well-Sid..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Kuo, Hsi-Yu ; Chu, Yu-Lin ; Dai, Hung-Da... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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9

NTIRE 2023 Challenge on Efficient Super-Resolution: Methods..:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops (CVPRW),
Li, Yawei ; Zhang, Yulun ; Timofte, Radu... - p. 1922-1960 , 2023
Link: https://doi.org/10.1109/..
 
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10

Improving the Operational Performance of Housekeeping Servi..:

, In: 2023 IEEE 12th Global Conference on Consumer Electronics (GCCE),
Yu, Cheng-You ; You, Chun-Ting ; Chen, Liang-Bi. - p. 1042-1043 , 2023
Link: https://doi.org/10.1109/..
 
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11

Protection Schemes for Plasma Induced Damage from Well-Side..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Kuo, Hsi-Yu ; Chu, Yu-Lin ; Dai, Hung-Da... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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12

List of contributors:

, In: Digital Manufacturing,
An, Jia ; Cai, Chao ; Chen, Chun-Hsien... - p. xiii-xiv , 2022
Link: https://doi.org/10.1016/..
 
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13

Micro LED sensor eye-tracking for augmented reality glasses..:

, In: 2022 29th International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD),
Luo, Cheng-Jhih ; Liang, Kai-Ling ; Chu, Chun-Wen... - p. 17-20 , 2022
Link: https://doi.org/10.23919..
 
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14

Shaving Retries with Sentinels for Fast Read over High-Dens..:

, In: 2020 53rd Annual IEEE/ACM International Symposium on Microarchitecture (MICRO),
Li, Qiao ; Ye, Min ; Cui, Yufei... - p. 483-495 , 2020
Link: https://doi.org/10.1109/..
 
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15

Polyphase Watt-Hour Measurement Methods Based on Back Propa..:

, In: 2020 International Conference on System Science and Engineering (ICSSE),
Lu, Chun-Liang ; Kuo, Yong-Lin - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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