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Kuo, Tan-Chun
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1

Design and implementation of a personal health monitoring s..:

, In: Proceedings of the 29th Annual ACM Symposium on Applied Computing,
Chen, Huan ; Liao, Guo-Tan ; Fan, Yao-Chung... - p. 33-35 , 2014
Link: https://dl.acm.org/doi/1..
 
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2

NTIRE 2023 Challenge on Stereo Image Super-Resolution: Meth..:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops (CVPRW),
Wang, Longguang ; Guo, Yulan ; Wang, Yingqian... - p. 1346-1372 , 2023
Link: https://doi.org/10.1109/..
 
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3

33.1 A 16nm 32Mb Embedded STT-MRAM with a 6ns Read-Access T..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Lee, Po-Hao ; Lee, Chia-Fu ; Shih, Yi-Chun... - p. 494-496 , 2023
Link: https://doi.org/10.1109/..
 
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4

List of contributors:

, In: Digital Manufacturing,
An, Jia ; Cai, Chao ; Chen, Chun-Hsien... - p. xiii-xiv , 2022
Link: https://doi.org/10.1016/..
 
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5

Miscellaneous Disorder of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,
Chung, Chen-Shuan ; Lee, Tzong-His ; Chou, Jen-Wei... - p. 85-108 , 2023
Link: https://doi.org/10.1007/..
 
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6

A Solution for Cascade Hydropower Station Reservoirs Optima..:

, In: Advances in Intelligent Systems and Computing; Advanced Machine Learning Technologies and Applications,
Dao, Thi-Kien ; Chang, Kuo-Chi ; Chu, Kai-Chun... - p. 976-986 , 2021
Link: https://doi.org/10.1007/..
 
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7

Integrated Design Ecosystem for Chiplets Heterogeneous Inte..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Wang, Chen-Chao ; Huang, Chih-Yi. - p. 1048-1053 , 2024
Link: https://doi.org/10.1109/..
 
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8

Neural Network Acceleration Using Digit-Plane Computation w..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Hsiao, Shen-Fu ; Kuo, Hou-Chun ; Kuo, Yu. - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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9

On-device Real-time Custom Hand Gesture Recognition:

, In: 2023 IEEE/CVF International Conference on Computer Vision Workshops (ICCVW),
Uboweja, Esha ; Tian, David ; Wang, Qifei... - p. 4275-4279 , 2023
Link: https://doi.org/10.1109/..
 
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10

Semiconductor Package Design Flow and Platform Applied on F..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Youle ; Chang, Keng-Tuan ; Kuo, Hung-Chun.. - p. 21-22 , 2023
Link: https://doi.org/10.23919..
 
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11

Achieving Uniform Memory Read Distribution in Storage Class..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Chang, Yu-Ming ; Kuo, Tai-Chun ; Shung, Chuen-Shen Bernard - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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12

A Low-Cost Antenna-in-Package (AiP) for D-Band Application:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kuo, Hung-Chun ; Wu, Po-I ; Jhong, Ming-Fong.. - p. 481-486 , 2023
Link: https://doi.org/10.1109/..
 
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13

Mitigate Package Level Crosstalk Using Tabbed Design:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Tsai, Cheng-Yu ; Kuo, Hung-Chun ; Jhong, Ming-Fong. - p. 237-239 , 2023
Link: https://doi.org/10.1109/..
 
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14

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
Link: https://doi.org/10.1109/..
 
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15

Crosstalk Mitigation for High Speed SerDes Applications on ..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),
Hung, Li-Chieh ; Kuo, Hung-Chun ; Jhong, Ming-Fong. - p. 160-163 , 2023
Link: https://doi.org/10.1109/..
 
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