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2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) ,
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Shielding effectiveness estimation for shielding box having..:
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Proceedings of the Winter Simulation Conference ,
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Machine learning (reinforcement learning)-based steel stock..:
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2023 23rd International Conference on Control, Automation and Systems (ICCAS) ,
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2.5D SLAM Algorithm with Novel Data Fusion Method Between 2..:
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2020 IEEE International Solid- State Circuits Conference - (ISSCC) ,
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13.1 A 1Tb 4b/cell NAND Flash Memory with tPROG=2ms, tR=110..:
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2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers. ,
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Highly Scalable Saddle-Fin (S-Fin) Transistor for Sub-50nm ..:
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2024 IEEE Intelligent Vehicles Symposium (IV) ,
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Hierarchical Climate Control Strategy for Electric Vehicles..:
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2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) ,
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Antenna diversity method for emission measurements in a rev..:
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2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) ,
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Immunity tests in a reverberation chamber using a correctio..:
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Software Engineering in IoT, Big Data, Cloud and Mobile Computing; Studies in Computational Intelligence ,
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The Optimal Use of Public Cloud Service Provider When Trans..:
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Software Engineering in IoT, Big Data, Cloud and Mobile Computing; Studies in Computational Intelligence ,
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The Triple Layered Business Model Canvas for Sustainability..:
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2019 20th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing (SNPD) ,
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A Study on The Sustainable Value Generation of Mobile Messe..:
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2019 20th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing (SNPD) ,
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Using Stochastic Gradient Decent Algorithm For Incremental ..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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33.7 An Adhesive Interposer-Based Reconfigurable Multi-Sens..:
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2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) ,
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Thermal Conductivity Detector (TCD)-Type Gas Sensor Based o..:
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2020 IEEE Applied Power Electronics Conference and Exposition (APEC) ,
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