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Kwon, Seok Jin
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1

Investigation of defective bonding pad affected by the cont..:

, In: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Kwon, Soon Seok ; Hwang, Sung Min ; Kim, Hyoung Ryeun... - p. 149-153 , 2017
Link: https://doi.org/10.1109/..
 
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2

22.2 An 8.5Gb/s/pin 12Gb-LPDDR5 SDRAM with a Hybrid-Bank Ar..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Chi, Hyung-Joon ; Lee, Chang-Kyo ; Park, Junghwan... - p. 382-384 , 2020
Link: https://doi.org/10.1109/..
 
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3

List of Contributors:

, In: Bladder Cancer,
Burton, Jeremy P. ; Chanyi, Ryan M. ; Cho, Jeong Y.... - p. xxi-xxiii , 2018
Link: https://doi.org/10.1016/..
 
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4

A 3.0 Gb/s/pin 4th generation F-chip with Toggle 5.0 Specif..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Jo, Youngmin ; Kavala, Anil ; Kim, Tongsung... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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5

Sustainable Environmental Technologies for Advanced Semicon..:

, In: 2023 International Electron Devices Meeting (IEDM),
Lee, Hyun Chul ; Oh, Sehyeong ; Yang, Dong Sik... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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6

Contributors:

, In: Graphene for Flexible Lighting and Displays,
Cho, Hyunsu ; Cho, Nam Sung ; Choi, Yong Seok... - p. vii-viii , 2020
Link: https://doi.org/10.1016/..
 
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7

Real user-environment migration between heterogeneous ISA p..:

, In: Proceedings of the 6th International Conference on Ubiquitous Information Management and Communication,
Cho, Seong Jin ; Lee, Kyung Min ; Kim, Yong Seok... - p. 1-9 , 2012
Link: https://dl.acm.org/doi/1..
 
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8

The profiling method in multicore processor for effective p..:

, In: Proceedings of the 6th International Conference on Ubiquitous Information Management and Communication,
Yoon, Seung Hyun ; Lee, Kyung Min ; Kim, Yong Seok... - p. 1-4 , 2012
Link: https://dl.acm.org/doi/1..
 
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9

A new digital video watermarking using the dual watermark i..:

, In: 2004 IEEE Region 10 Conference TENCON 2004.,
Seung-Jin Kim ; Suk-Hwan Lee ; Kwang-Seok Moon... - p. 291,292,293,294 , 2004
Link: https://doi.org/10.1109/..
 
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10

13.4 A 48GB 16-High 1280GB/s HBM3E DRAM with All-Around Pow..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lee, Jinhyung ; Cho, Kyungjun ; Lee, Chang Kwon... - p. 238-240 , 2024
Link: https://doi.org/10.1109/..
 
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11

Efficient 3D Object Detection Models and Evaluation Method ..:

, In: 2023 IEEE Intelligent Vehicles Symposium (IV),
Lee, Jin-Hee ; Lee, Jae-Keun ; Lee, Joohyun.. - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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12

Dual Adaptive Data Augmentation for 3D Object Detection:

, In: 2023 14th International Conference on Information and Communication Technology Convergence (ICTC),
Lee, Joohyun ; Lee, Jin-Hee ; Lee, Jae-Keun... - p. 1732-1737 , 2023
Link: https://doi.org/10.1109/..
 
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13

ASIL-D Compliant Battery Monitoring IC with High Measuremen..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Lee, Jong-Kyoung ; Woo, Sunsik ; Jeong, Wooyoung... - p. 322-324 , 2023
Link: https://doi.org/10.1109/..
 
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14

PT Bottle Classification Function for Pfand Equipment:

, In: 2023 8th International Conference on Business and Industrial Research (ICBIR),
Kwon, So-Young ; Kim, Young-Hyung ; Lee, Jong-Seok... - p. 1124-1127 , 2023
Link: https://doi.org/10.1109/..
 
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15

A 1-Tb, 4b/Cell, 176-Stacked-WL 3D-NAND Flash Memory with I..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Cho, Wanik ; Jung, Jongseok ; Kim, Jongwoo... - p. 134-135 , 2022
Link: https://doi.org/10.1109/..
 
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