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Kwon, Y. K.
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1

Self-assembly strategy of nanomanufacturing of hybrid devic..:

, In: The Oxford handbook of nanoscience and technology / edited by A.V. Narlikar and Y.Y. Fu
Hong, S. ; Kwon, Y.-K. ; Ha, J.S..... (2017) 
Link: https://doi.org/10.1093/..
 
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2

A 16-channel Active-Matrix Mini-LED Driver with an USI-B fo..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Kwon, Y. ; Kwak, Y. ; Choi, Y.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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3

A Holistic Methodology Toward Large-scale AI Implementation..:

, In: 2023 International Electron Devices Meeting (IEDM),
Park, S. ; Kim, J. ; Koo, W.... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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4

A Low Noise Read-Out IC with Gate Driver for Full Front Dis..:

, In: 2020 IEEE Symposium on VLSI Circuits,
Kwon, Y. ; Kim, M. ; Park, S.... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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5

A V-band switched beam-forming network using absorptive SP4..:

, In: 2010 IEEE MTT-S International Microwave Symposium,
Park, K. ; Choi, W. ; Kim, Y... - p. 1-1 , 2010
Link: https://doi.org/10.1109/..
 
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6

Application of a network dynamics analysis tool to mobile a..:

, In: Proceedings of the 9th ACM international symposium on Modeling analysis and simulation of wireless and mobile systems,
Syrotiuk, V. R. ; Shaukat, K. ; Kwon, Y. J... - p. 36-43 , 2006
Link: https://dl.acm.org/doi/1..
 
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7

A novel MEMS probe array for the biological measurement:

, In: IEEE MTT-S International Microwave Symposium Digest, 2005.,
Kim, J.M. ; Oh, D.H. ; Baek, C.-W.... - p. None , 2005
Link: https://doi.org/10.1109/..
 
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8

Contributors:

, In: Handbook of Metal Injection Molding,
Ahn, S. ; Atre, S.V. ; Banerjee, S.... - p. xiii-xiv , 2019
Link: https://doi.org/10.1016/..
 
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9

List of contributors:

, In: Dynamic Deformation, Damage and Fracture in Composite Materials and Structures,
Abrate, S. ; Ahmadi, M. ; Bahei-El-Din, Y.... - p. xi-xii , 2016
Link: https://doi.org/10.1016/..
 
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10

List of contributors:

, In: Structural Integrity and Durability of Advanced Composites,
Adams, R.D. ; Arora, H. ; Ashbee, K.H.G.... - p. xv-xvii , 2015
Link: https://doi.org/10.1016/..
 
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11

Contributor contact details:

, In: Handbook of Metal Injection Molding,
Heaney, Donald F. ; German, R.M. ; Atre, S.V.... - p. xiii-xvi , 2012
Link: https://doi.org/10.1016/..
 
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12

Program slicing based on specification:

, In: Proceedings of the 2001 ACM symposium on Applied computing,
Chung, I. S. ; Lee, W. K. ; Yoon, G. S.. - p. 605-609 , 2001
Link: https://dl.acm.org/doi/1..
 
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13

MDSP-II: 16-bit DSP with mobile communication accelerator:

, In: Proceedings of the IEEE 1998 Custom Integrated Circuits Conference (Cat. No.98CH36143),
Kim, B.W. ; Yang, J.H. ; Kwon, Y.S.... - p. 5,6,7,8 , 1998
Link: https://doi.org/10.1109/..
 
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14

Elimination of Butterfly-Lobes by a New Stacking Arrangemen..:

, In: 2006 IEEE Antennas and Propagation Society International Symposium,
Kim, C.H. ; Lee, D.K. ; Park, J.K.... - p. 4213-4216 , 2006
Link: https://doi.org/10.1109/..
 
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15

Ta/sub 2/O/sub 5//TiO/sub 2/ Composite Films For High Densi..:

, In: Symposium 1993 on VLSI Technology,
Kwon, K.W. ; Kang, C.S. ; Choi, G.H.... - p. 45-46 , 1993
Link: https://doi.org/10.1109/..
 
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