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LAI, Yu-long
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1

MLVSNet: Multi-level Voting Siamese Network for 3D Visual T..:

, In: 2021 IEEE/CVF International Conference on Computer Vision (ICCV),
Wang, Zhoutao ; Xie, Qian ; Lai, Yu-Kun... - p. 3081-3090 , 2021
Link: https://doi.org/10.1109/..
 
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2

Detecting rule of simplicity from photos:

, In: Proceedings of the 20th ACM international conference on Multimedia,
Mai, Long ; Le, Hoang ; Niu, Yuzhen.. - p. 1149-1152 , 2012
Link: https://dl.acm.org/doi/1..
 
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3

Process Simulation Investigation of Purification and Deacid..:

, In: Proceedings of the International Petroleum and Petrochemical Technology Conference 2020,
Lai, Xing-yu ; Jiang, Wen-ming ; Chen, Jia-nan... - p. 266-284 , 2021
Link: https://doi.org/10.1007/..
 
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4

Optical Fiber Communication and Wireless Communication Tech..:

, In: Lecture Notes in Electrical Engineering; Nuclear Power Plants: Innovative Technologies for Instrumentation and Control Systems,
Yang, Xiao-Chen ; Yan, Zhen-Yu ; Chun, Zeng-Jun. - p. 316-331 , 2021
Link: https://doi.org/10.1007/..
 
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5

Low DRAM Memory Access and Flexible Dataflow Convolutional ..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Chen, Yi-Fan ; Chang, Yu-Jen ; Chiu, Ching-Te... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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6

Optical Camera Communication via RGB-LEDs and Deep Learning..:

, In: 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE),
Han, Yu-Ting ; Lai, Cheng-Yan ; Wu, Wen-Long... - p. 658-660 , 2023
Link: https://doi.org/10.1109/..
 
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7

Learning the Co-evolution Process on Live Stream Platforms ..:

, In: Proceedings of the 32nd ACM International Conference on Information and Knowledge Management,
Lai, Hsu-Chao ; Yu, Philip S. ; Huang, Jiun-Long - p. 1158-1167 , 2023
Link: https://dl.acm.org/doi/1..
 
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8

Application of Nonlinear Oscillator in Artificial Heartbeat..:

, In: 2023 5th International Academic Exchange Conference on Science and Technology Innovation (IAECST),
Yu, Jiahan ; Lai, Yi-Horng ; Long, Yi. - p. 894-897 , 2023
Link: https://doi.org/10.1109/..
 
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9

Post-Buckling Analysis for Addressing Asymmetric Warping of..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chen, Chia-Yu ; Lee, Yu-Ching ; Chen, Kuo-Shen... - p. 265-266 , 2023
Link: https://doi.org/10.23919..
 
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10

HarDNet-DFUS: Enhancing Backbone and Decoder of HarDNet-MSE..:

, In: Diabetic Foot Ulcers Grand Challenge; Lecture Notes in Computer Science,
Liao, Ting-Yu ; Yang, Ching-Hui ; Lo, Yu-Wen... - p. 21-30 , 2023
Link: https://doi.org/10.1007/..
 
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11

Optimizing Wirelength And Delay of FPGA Tile through Floorp..:

, In: 2023 IEEE 15th International Conference on ASIC (ASICON),
Long, Honghong ; Bai, Yu ; Li, Yanze.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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12

Reliability Prediction and Improvement of Board-Level Therm..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Dao-Long ; Chen, Tang-Yuan ; Lai, Wei-Hong... - p. 995-998 , 2023
Link: https://doi.org/10.1109/..
 
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13

List of contributors:

, In: Current Developments in Biotechnology and Bioengineering,
Atoliya, Nagvanti ; Bajpai, Apekcha ; Basotra, Neha... - p. xi-xiii , 2022
Link: https://doi.org/10.1016/..
 
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14

Die Bonding Solution for Flip Chip-Chip Scale Package-DIC (..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Liao, Po Yu ; Ho, Ian ; Lai, David... - p. 182-186 , 2022
Link: https://doi.org/10.1109/..
 
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15

The thermal stability improvement of spin-orbit-torque (SOT..:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Chang, Yao-Jen ; Chen, Fang-Ming ; Chen, Kuan-Ming... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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