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Lai, Chao-Hung
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1

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
Link: https://doi.org/10.1109/..
 
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2

Running Requirements Analysis to Acquire the Key Success Fa..:

, In: 2022 International Conference on Advanced Enterprise Information System (AEIS),
Yang, Hao-Wei ; Lee, Shuo ; Huang, Chao-Hung. - p. 52-59 , 2022
Link: https://doi.org/10.1109/..
 
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3

Annealing effect on the ZrO2 gradual resistance change as a..:

, In: 2022 8th International Conference on Applied System Innovation (ICASI),
Lai, Chun-Hung ; Syu, Ming-Yi ; Liu, Chih-Yi. - p. 96-97 , 2022
Link: https://doi.org/10.1109/..
 
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4

A Secure User Authenticated Scheme in Intelligent Manufactu..:

, In: Communications in Computer and Information Science; New Trends in Computer Technologies and Applications,
Chen, Ming-Te ; Liu, Hao-Yu ; Lai, Chien-Hung.. - p. 543-549 , 2019
Link: https://doi.org/10.1007/..
 
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5

Effect of Augmented Reality on Astronomical Observation Ins..:

, In: Lecture Notes in Computer Science; Innovative Technologies and Learning,
Chiang, Chia-Ling ; Lin, Yu-Lin ; Chao, Han-Chieh.. - p. 184-193 , 2019
Link: https://doi.org/10.1007/..
 
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6

Register-Pressure Aware Predicator for Length Multiplier of..:

, In: Workshop Proceedings of the 51st International Conference on Parallel Processing,
Shih, Meng-Shiuan ; Lai, Hung-Ming ; Lee, Chao-Lin.. - p. 1-9 , 2022
Link: https://dl.acm.org/doi/1..
 
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7

34.4 A 3nm, 32.5TOPS/W, 55.0TOPS/mm2 and 3.78Mb/mm2 Fully-D..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Fujiwara, Hidehiro ; Mori, Haruki ; Zhao, Wei-Chang... - p. 572-574 , 2024
Link: https://doi.org/10.1109/..
 
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8

Evaluation of Effect of 3D Scanning on Building Models in R..:

, In: 2023 IEEE 3rd International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB),
Li, Chang-Hung ; Cheng, Jui-Hung ; Huang, Tzu-Teng. - p. 241-244 , 2023
Link: https://doi.org/10.1109/..
 
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9

Spread Movement Prediction for Pairs Trading with High-Freq..:

, In: 2022 IEEE International Conference on Big Data and Smart Computing (BigComp),
Su, Chiu-Hung ; Lai, Hsu-Chao ; Shih, Wen-Yueh.. - p. 64-71 , 2022
Link: https://doi.org/10.1109/..
 
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10

Energy Efficient Fog RAN (F-RAN) with Flexible BBU Resource..:

, In: 2019 IEEE 90th Vehicular Technology Conference (VTC2019-Fall),
Lin, Chi-Hung ; Chien, Wei-Che ; Chen, Jen-Yeu.. - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
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11

Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Yang, Hung-Chun ; Lai, Wei-Hong ; Kao, Chin-Li.. - p. 151-152 , 2024
Link: https://doi.org/10.23919..
 
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12

Load Balancing Algorithms and Their Impacts on Apache Kafka:

, In: 2023 IEEE International Conference on Big Data (BigData),
Hsiao, Hung-Chang ; Tsai, Chia-Ping ; Li, Zheng-Xian... - p. 1726-1735 , 2023
Link: https://doi.org/10.1109/..
 
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13

On EDA solutions for reconfigurable memory-centric AI edge ..:

, In: Proceedings of the 39th International Conference on Computer-Aided Design,
Chen, Hung-Ming ; Hu, Chia-Lin ; Chang, Kang-Yu... - p. 1-8 , 2020
Link: https://dl.acm.org/doi/1..
 
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14

A 512Gb In-Memory-Computing 3D-NAND Flash Supporting Simila..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Hu, Han-Wen ; Wang, Wei-Chen ; Chen, Chung-Kuang... - p. 138-140 , 2022
Link: https://doi.org/10.1109/..
 
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15

Support Convolution of CNN with Compression Sparse Matrix M..:

, In: 50th International Conference on Parallel Processing Workshop,
Liao, Hui-Hsin ; Lee, Chao-Lin ; Lee, Jenq-Kuen... - p. 1-7 , 2021
Link: https://dl.acm.org/doi/1..
 
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