Lai, Chin-Yu
695  results:
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1

Congestion-aware downlink scheduling for IEEE 802.16j multi..:

, In: Proceedings of the 4th Annual International Conference on Wireless Internet,
 
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2

IoB-Enhanced Deep Learning for Non-specific Thermal Respira..:

, In: 2023 IEEE International Conference on Networking, Sensing and Control (ICNSC),
 
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3

Using Immersive Virtual Reality to Explore the Learning Per..:

, In: Lecture Notes in Computer Science; Innovative Technologies and Learning,
Cheng, Yu-Ping ; Lai, Chin-Feng ; Cheng, Shu-Chen. - p. 107-116 , 2022
 
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4

Exploring the Usability of Web-Based Java Compiler as a Lea..:

, In: Lecture Notes in Computer Science; Innovative Technologies and Learning,
Jeng, Yu-Lin ; Huang, Sheng-Bo ; Lai, Chin-Feng. - p. 161-169 , 2021
 
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5

Exploring the Impact of Artificial Intelligence Learning Pl..:

, In: Lecture Notes in Computer Science; Innovative Technologies and Learning,
Zhong, Hua-Xu ; Lai, Chin-Feng ; Huang, Yu-Che.. - p. 22-29 , 2021
 
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6

Intelligent Power Charging Strategy in Wireless Rechargeabl..:

, In: 2019 23rd International Computer Science and Engineering Conference (ICSEC),
Chien, Wei-Che ; Chang, Yao-Chung ; Lin, Yu-Shan.. - p. 246-250 , 2019
 
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7

Effective Computational Models for Addressing Asymmetric Wa..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lee, Yu-Chin ; Chen, Chia-Yu ; Chen, Kuo-Shen... - p. 1068-1073 , 2022
 
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8

Assessing Teachers' Use of English E-Textbooks over Time: A..:

, In: Communications in Computer and Information Science; Learning Technology for Education Challenges,
Lai, Hui-Min ; Hsieh, Pi-Jung ; Zhang, Ren-Cheng. - p. 125-138 , 2022
 
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9

List of contributors:

, In: Semiconducting Polymer Materials for Biosensing Applications,
 
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10

Contributors:

, In: Ionic Liquids and Their Application in Green Chemistry,
 
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11

High Acceleration Dynamic Methodology for Board-Level Shock..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yu, Min-Cheng ; Wu, Nan-Yi ; Wang, Wu-Lung... - p. 1213-1218 , 2024
 
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12

Solder Joint Reliability Comparison Under JEDEC Drop and Sy..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Shih, Meng-Kai ; Ke, Zih-Jun ; Yen, Chun-Yu.. - p. 153-154 , 2024
 
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13

Post-Buckling Analysis for Addressing Asymmetric Warping of..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chen, Chia-Yu ; Lee, Yu-Ching ; Chen, Kuo-Shen... - p. 265-266 , 2023
 
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14

A 512Gb In-Memory-Computing 3D-NAND Flash Supporting Simila..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Hu, Han-Wen ; Wang, Wei-Chen ; Chen, Chung-Kuang... - p. 138-140 , 2022
 
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15

Design of Drone Remote-Control System using Human Motion Re..:

, In: 2022 IEEE 5th Eurasian Conference on Educational Innovation (ECEI),
Chen, Shyh-Wei ; Lai, Yu-Chun ; Liu, Chia-Hui. - p. 148-151 , 2022
 
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