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Lan, Kai-Wei
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1

Life Cycle Assessment for Manufacturing of Solid Electrolyt..:

, In: 2024 IEEE Transportation Electrification Conference and Expo (ITEC),
Liu, Zheng ; Lan, Kai-Wei ; Braun, Paul V.... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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2

TCF-Tailoring Vertically Stepped Structures for Temperature..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Lan, Kai-Wei ; Chung, I-Fei ; Tsai, Chun-Pu.. - p. 140-143 , 2024
Link: https://doi.org/10.1109/..
 
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3

A Comprehensive Comparison for Battery Cathode Leaching Pro..:

, In: 2023 IEEE Transportation Electrification Conference & Expo (ITEC),
Liu, Zheng ; Sederholm, Jarom G. ; Lan, Kai-Wei... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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4

Nanotwinned Copper Hybrid Bonding and Wafer-On-Wafer Integr..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chiu, Wei-Lan ; Chou, Kai-Wei ; Chang, Hsiang-Hung - p. 210-215 , 2020
Link: https://doi.org/10.1109/..
 
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5

Efficient TIS Sensitivity Measurement With Machine Learning..:

, In: 2024 IEEE 21st Consumer Communications & Networking Conference (CCNC),
Chen, Yi-Wei ; Tsai, Min-Je ; Lu, Henry Horng-Shing... - p. 1032-1033 , 2024
Link: https://doi.org/10.1109/..
 
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6

Compensation and Control of Sinusoidal Torque Measurement E..:

, In: 2023 42nd Chinese Control Conference (CCC),
Chen, Wei ; Lan, Chunyun ; Li, Kai. - p. 3086-3090 , 2023
Link: https://doi.org/10.23919..
 
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7

ESD-capability Influences of UHV Circular nLDMOS Transistor..:

, In: 2020 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Lan, Tien-Yu ; Chen, Shen-Li ; Fan, Sheng-Kai... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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8

AIM 2020 Challenge on Efficient Super-Resolution: Methods a..:

, In: Computer Vision – ECCV 2020 Workshops; Lecture Notes in Computer Science,
Zhang, Kai ; Danelljan, Martin ; Li, Yawei... - p. 5-40 , 2020
Link: https://doi.org/10.1007/..
 
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9

ESD-ability of Circular nLDMOS Transistors of UHV by Super-..:

, In: 202020 3rd IEEE International Conference on Knowledge Innovation and Invention (ICKII),
Lan, Tien-Yu ; Chen, Shen-Li ; Lin, Po-Lin... - p. 57-58 , 2020
Link: https://doi.org/10.1109/..
 
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10

O-Displaying : an orientation-based augmented reality di..:

, In: SIGGRAPH Asia 2017 Posters,
Lan, Yi-Shan ; Sun, Shih-Wei ; Hua, Kai-Lung. - p. 1-2 , 2017
Link: https://dl.acm.org/doi/1..
 
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11

Chalcogenides Phase Change Materials for PICs:

, In: 2024 IEEE Silicon Photonics Conference (SiPhotonics),
Xu, Kai ; Wei, Maoliang ; Lei, Kunhao... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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12

List of contributors:

, In: Xenes,
Akinwande, Deji ; Alam, Md. Hasibul ; Angot, Thierry... - p. xiii-xvii , 2022
Link: https://doi.org/10.1016/..
 
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13

Fault Diagnosis and Condition Evaluation for Soft Start of ..:

, In: 2022 41st Chinese Control Conference (CCC),
Kai, Li ; Zhaorui, Li ; Huazhan, Gui... - p. 4179-4184 , 2022
Link: https://doi.org/10.23919..
 
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14

A symmetric additive homomorphic encryption scheme based on..:

, In: Proceedings of the 2022 International Conference on Cyber Security,
Liu, Wei ; Hao, Hua Xiao ; Wan, Lan Ai... - p. 25-33 , 2022
Link: https://dl.acm.org/doi/1..
 
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15

List of contributors:

, In: Water Security: Big Data-Driven Risk Identification, Assessment and Control of Emerging Contaminants,
Abdelkarim, Esraa A. ; Ali, Sameh S. ; Al-Tohamy, Rania... - p. xvii-xxiv , 2024
Link: https://doi.org/10.1016/..
 
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