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Larivière, O.
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1

Exploring W-Cu hybrid dual damascene metallization for futu..:

, In: 2021 IEEE International Interconnect Technology Conference (IITC),
van der Veen, Marleen H. ; Pedreira, O. Varela ; Heylen, N.... - p. 1-3 , 2021
Link: https://doi.org/10.1109/..
 
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2

Metal reliability mechanisms in Ruthenium interconnects:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Pedreira, O. Varela ; Stucchi, M. ; Gupta, A.... - p. 1-7 , 2020
Link: https://doi.org/10.1109/..
 
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3

Hybrid Metallization with Cu in sub 30nm Interconnects:

, In: 2020 IEEE International Interconnect Technology Conference (IITC),
van der Veen, Marleen H. ; Soethoudt, J. ; Delabie, A.... - p. 16-18 , 2020
Link: https://doi.org/10.1109/..
 
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4

List of Contributors:

, In: Dictionary of Sport Psychology,
Abrams, Mitch ; Allan, Veronica ; Altfeld, Sebastian... - p. vii-xi , 2019
Link: https://doi.org/10.1016/..
 
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5

Three-Layer BEOL Process Integration with Supervia and Self..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Vega-Gonzalez, V. ; Bekaert, J. ; Kesters, E.... - p. 19.3.1-19.3.4 , 2019
Link: https://doi.org/10.1109/..
 
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