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Law, Sam-Po
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1

Causal Perception in Question-Answering Systems:

, In: Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems,
Law, Po-Ming ; Lo, Leo Yu-Ho ; Endert, Alex.. - p. 1-15 , 2021
Link: https://dl.acm.org/doi/1..
 
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2

Characterizing Automated Data Insights:

, In: 2020 IEEE Visualization Conference (VIS),
Law, Po-Ming ; Endert, Alex ; Stasko, John - p. 171-175 , 2020
Link: https://doi.org/10.1109/..
 
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3

What are Data Insights to Professional Visualization Users?:

, In: 2020 IEEE Visualization Conference (VIS),
Law, Po-Ming ; Endert, Alex ; Stasko, John - p. 181-185 , 2020
Link: https://doi.org/10.1109/..
 
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4

Comparing Apples and Oranges : Taxonomy and Design of Pa..:

, In: Proceedings of the 2019 CHI Conference on Human Factors in Computing Systems,
Law, Po-Ming ; Das, Subhajit ; Basole, Rahul C. - p. 1-12 , 2019
Link: https://dl.acm.org/doi/1..
 
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5

Secure Medical Data Management Based on Homomorphic Encrypt..:

, In: 2023 IEEE 8th International Conference on Smart Cloud (SmartCloud),
Law, Po Ying ; Tsai, Chia-Cheng ; Fok, Tsz Wun... - p. 95-98 , 2023
Link: https://doi.org/10.1109/..
 
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6

Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packa..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Jay ; Zhang, Zen-Wei ; Lin, Vito... - p. 2107-2111 , 2024
Link: https://doi.org/10.1109/..
 
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7

Antenna-in-Package Electrical Research for Beyond 5G applic..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Lai, Chia-Chu ; Lin, Sam ; Shih, Teny.. - p. 63-66 , 2023
Link: https://doi.org/10.1109/..
 
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8

Innovative Fan-Out Embedded Bridge Structure for Co-Package..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Li, Jay ; Hsu, Terry ; Zhuan, Ming-Han... - p. 228-232 , 2023
Link: https://doi.org/10.1109/..
 
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9

Design of Single Miniaturized Dielectric Resonant Antenna f..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lai, Chia-Chu ; Lin, Sam ; Shih, Teny... - p. 1820-1824 , 2023
Link: https://doi.org/10.1109/..
 
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10

Fan-Out Higher Layer Heterogeneous Solution in HPC Applicat..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Kao, Feng ; Wang, David ; Lin, Sam... - p. 01-03 , 2022
Link: https://doi.org/10.1109/..
 
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11

Comparison of Sub-Scalp EEG and Endovascular Stent-Electrod..:

, In: 2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC),
Mahoney, Timothy B. ; Liu, Po-Chen ; Grayden, David B.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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12

Contributors:

, In: Autophagy: Cancer, Other Pathologies, Inflammation, Immunity, Infection, and Aging,
Arakawa, Satoko ; Khan, Mohammad Aslam ; Bauer, Peter O.... - p. xix-xxi , 2014
Link: https://doi.org/10.1016/..
 
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13

Hardware assisted volume rendering of unstructured grids by..:

, In: Proceedings of the 1996 symposium on Volume visualization,
Reed, David M. ; Yagel, Roni ; Law, Asish.. - p. 55-ff. , 1996
Link: https://dl.acm.org/doi/1..
 
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14

Electrical Performance Enhancement Solution with FO-EB in H..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Su, Po Yuan James ; Ho, David ; Wang, Yu Po... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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