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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:
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2022 International Conference on Electronics Packaging (ICEP) ,
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Characteristic Analysis of a Multi-chip Embedded Interposer..:
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2020 IEEE Asian Solid-State Circuits Conference (A-SSCC) ,
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Improved Design and In Vivo Animal Tests of Bone-Guided Coc..:
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2019 International Conference on Computing, Electronics & Communications Engineering (iCCECE) ,
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A Novel Surgery Navigation System Combined with Augmented R..:
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Proceedings of the 26th ACM international conference on Multimedia ,
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An Iterative Refinement Approach for Social Media Headline ..:
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2014 IEEE Energy Conversion Congress and Exposition (ECCE) ,
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Zero-sequence voltage injection for DC capacitor voltage ba..:
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ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) ,
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Defending against Clean-Image Backdoor Attack in Multi-Labe..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Effect of Underfill Additive Agents on Crack Prevention in ..:
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A Research Agenda for Consumer Financial Behavior ,
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Neuroscience and consumer financial behavior:
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Computational Thinking Education ,
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Video Games: A Potential Vehicle for Teaching Computational..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
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A Resistor-Based High-Resolution Temperature-to-Digital Con..:
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2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) ,
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L-Band LiNbO3/SiO2/Sapphire Longitudinal Leaky Saw (LLSAW) ..:
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2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) ,
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A Dispersion-Engineered YX-LN/SIO2/Sapphire SH-SAW Resonato..:
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2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) ,
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