Lee, Chia Ching
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1

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
 
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2

Benign Neoplasms of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,
 
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3

Characteristic Analysis of a Multi-chip Embedded Interposer..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lee, Ching Kuan ; Liu, Wen-Hung ; Chang, Shu-Yi... - p. 55-56 , 2022
 
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4

Improved Design and In Vivo Animal Tests of Bone-Guided Coc..:

, In: 2020 IEEE Asian Solid-State Circuits Conference (A-SSCC),
 
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5

A Novel Surgery Navigation System Combined with Augmented R..:

, In: 2019 International Conference on Computing, Electronics & Communications Engineering (iCCECE),
Chiou, Shin-Yan ; Liu, Hao-Li ; Lee, Chia-Wei... - p. 173-176 , 2019
 
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6

An Iterative Refinement Approach for Social Media Headline ..:

, In: Proceedings of the 26th ACM international conference on Multimedia,
Hsu, Chih-Chung ; Lee, Chia-Yen ; Liao, Ting-Xuan... - p. 2008-2012 , 2018
 
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7

Zero-sequence voltage injection for DC capacitor voltage ba..:

, In: 2014 IEEE Energy Conversion Congress and Exposition (ECCE),
Lee, Chia-Tse ; Chen, Hsin-Chih ; Wang, Ching-Wei... - p. 4670-4676 , 2014
 
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8

Defending against Clean-Image Backdoor Attack in Multi-Labe..:

, In: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Lee, Cheng-Yi ; Tsai, Cheng-Chang ; Kao, Ching-Chia.. - p. 5500-5504 , 2024
 
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9

Effect of Underfill Additive Agents on Crack Prevention in ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chen, Ching-Chia ; Teng, Wen-Yu ; Tsai, Fang Lin... - p. 477-480 , 2022
 
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10

Neuroscience and consumer financial behavior:

, In: A Research Agenda for Consumer Financial Behavior,
 
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12

A Resistor-Based High-Resolution Temperature-to-Digital Con..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lee, Rui-Song ; Lam, Chak-Hong ; Chen, Wei-Hao... - p. 1-3 , 2024
 
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13

L-Band LiNbO3/SiO2/Sapphire Longitudinal Leaky Saw (LLSAW) ..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Lee, Zhi-Qiang ; Hsu, Tzu-Hsuan ; Tsai, Chia-Hsien... - p. 1095-1098 , 2024
 
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14

A Dispersion-Engineered YX-LN/SIO2/Sapphire SH-SAW Resonato..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
 
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15

A Thin-Film Lithium Niobate on Insulator Multimode SH-SAW R..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
 
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