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Proceedings of the 2023 7th International Conference on Medical and Health Informatics ,
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Attitudes towards the Covid-19 Vaccine among Healthcare Wor..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
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Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocry..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:
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Communications in Computer and Information Science; HCI International 2023 Posters ,
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Use of Semiotics on the Character Development of Choreograp..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Low Temperature and Fine Pitch Nanocrystalline Cu/SiCN Wafe..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Surface modification on hydrophilicity enhancement using NH..:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Low Thermal Budget Cu/SiO2 Hybrid Bonding Using Highly -ori..:
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2022 International Conference on Electronics Packaging (ICEP) ,
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Low temperature Cu/SiO2 hybrid bonding fabricated by 2-step..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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A hybrid bonding interconnection with a novel low-temperatu..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Low-Temperature Wafer-to-Wafer Hybrid Bonding by Nanocrysta..:
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2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) ,
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Improvement of Nanotwinned Copper Thermal Stability for Hig..:
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2023 International Electron Devices Meeting (IEDM) ,
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Low N-Type Contact Resistance to Carbon Nanotubes in Highly..:
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Proceedings of the 25th Annual International Conference on Digital Government Research ,
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