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Lee, Chiu-Hsiang
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1

Attitudes towards the Covid-19 Vaccine among Healthcare Wor..:

, In: Proceedings of the 2023 7th International Conference on Medical and Health Informatics,
Izguden, Dilruba ; Erdem, Ramazan ; Bostan, Sedat... - p. 365-371 , 2023
Link: https://dl.acm.org/doi/1..
 
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2

Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocry..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lin, Ang-Ying ; Lin, Yu-Min ; Lu, Chun-Lin... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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3

Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chiu, Wei-Lan ; Lee, Ou-Hsiang ; Chang, Hsiang-Hung... - p. 319-324 , 2024
Link: https://doi.org/10.1109/..
 
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4

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
Link: https://doi.org/10.1109/..
 
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5

Use of Semiotics on the Character Development of Choreograp..:

, In: Communications in Computer and Information Science; HCI International 2023 Posters,
Lee, Jui-Hsiang ; Chiu, Shu-Ling - p. 453-460 , 2023
Link: https://doi.org/10.1007/..
 
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6

Low Temperature and Fine Pitch Nanocrystalline Cu/SiCN Wafe..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chiu, Wei-Lan ; Lee, Ou-Hsiang ; Kuo, Tzu-Ying... - p. 1105-1109 , 2023
Link: https://doi.org/10.1109/..
 
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7

Surface modification on hydrophilicity enhancement using NH..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Ong, Jia-Juen ; Tran, Dinh-Phuc ; Chiu, Wei-Lan... - p. 1549-1552 , 2023
Link: https://doi.org/10.1109/..
 
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8

Low Thermal Budget Cu/SiO2 Hybrid Bonding Using Highly -ori..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Ong, Jia-Juen ; Tran, Dinh-Phuc ; Hsun, Yu-Min... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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9

Low temperature Cu/SiO2 hybrid bonding fabricated by 2-step..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Ong, Jia-Juen ; Chiu, Wei-Lan ; Lee, Ou-Hsiang.. - p. 135-136 , 2022
Link: https://doi.org/10.23919..
 
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10

A hybrid bonding interconnection with a novel low-temperatu..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Yu-Min ; Chang, Po-Chih ; Lee, Ou-Hsiang... - p. 2128-2134 , 2022
Link: https://doi.org/10.1109/..
 
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11

Low-Temperature Wafer-to-Wafer Hybrid Bonding by Nanocrysta..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chiu, Wei-Lan ; Lee, Ou-Hsiang ; Chiang, Chia-Wen. - p. 679-684 , 2022
Link: https://doi.org/10.1109/..
 
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12

Improvement of Nanotwinned Copper Thermal Stability for Hig..:

, In: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Chiu, Wei-Lan ; Hung, Ying Tzu ; Lee, Ou-Hsiang... - p. 1-2 , 2021
Link: https://doi.org/10.1109/..
 
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13

Low N-Type Contact Resistance to Carbon Nanotubes in Highly..:

, In: 2023 International Electron Devices Meeting (IEDM),
Safron, Nathaniel ; Chiu, Hsin-Yuan ; Chao, Tzu-Ang... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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14

COVID-19 Control and Prevention in Taipei: A Data-Driven Ap..:

, In: Proceedings of the 25th Annual International Conference on Digital Government Research,
Yu, Hsuan-Ta ; Chiu, Yichun ; Chen, Hui-Min... - p. 258-268 , 2024
Link: https://dl.acm.org/doi/1..
 
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15

Vascular Disorders of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,
Hsu, Wen-Hung ; Yu, Fang-Jung ; Wu, Deng-Chyang... - p. 69-84 , 2023
Link: https://doi.org/10.1007/..
 
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