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Lee, Chung-Pei
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1

FPGA Implementation of Floating Point Linear Programming:

, In: 2023 International Conference on System Science and Engineering (ICSSE),
Hsu, Chih-Chung ; Lee, Pei-Jun - p. 152-156 , 2023
Link: https://doi.org/10.1109/..
 
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2

The single-view depth map generation algorithm based on obj..:

, In: 2013 IEEE International Symposium on Consumer Electronics (ISCE),
Lee, Pei-Jun ; He, Jia-Jhih ; Chung, Yi-Ming... - p. 107-108 , 2013
Link: https://doi.org/10.1109/..
 
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3

A preliminary study on design and development of template-b..:

, In: 2010 IEEE International Conference on Industrial Engineering and Engineering Management,
Shih, Bih-Yaw ; Chen, Chen-Yuan ; Kuo, Jin-Wei... - p. 80-83 , 2010
Link: https://doi.org/10.1109/..
 
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4

Investigation of Stray Light Threshold for VR Head-Mounted ..:

, In: 2022 IEEE International Conference on Consumer Electronics - Taiwan,
Li, Hung-Chung ; Tsai, Meng-Che ; Lee, Tsung-Xian.. - p. 231-232 , 2022
Link: https://doi.org/10.1109/..
 
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5

A Preliminary Study of Transactive Memory System and Shared..:

, In: Transactions on Computational Science and Computational Intelligence; Advances in Software Engineering, Education, and e-Learning,
Chen, Pei-Chi ; Lee, Jung-Chieh ; Chen, Chung-Yang - p. 523-531 , 2021
Link: https://doi.org/10.1007/..
 
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6

Improving Edge Dead Domain and Endurance in Scaled HfZrOx F..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Lin, Yu-De ; Yeh, Po-Chun ; Tang, Ying-Tsan... - p. 6.4.1-6.4.4 , 2021
Link: https://doi.org/10.1109/..
 
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7

CMOS-compatible GaN HEMT on 200mm Si-substrate for RF appli..:

, In: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Yeh, Po-Chun ; Tu, Po-Tsung ; Liu, Hsueh-Hsing... - p. 1-2 , 2021
Link: https://doi.org/10.1109/..
 
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8

An Extremely Scaled Hemi-Cylindrical (HC) 3D NAND Device wi..:

, In: 2020 IEEE Symposium on VLSI Technology,
Du, Pei-Ying ; Lue, Hang-Ting ; Yeh, Teng-Hao... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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9

15.2 A 28nm 64Kb Inference-Training Two-Way Transpose Multi..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Su, Jian-Wei ; Si, Xin ; Chou, Yen-Chi... - p. 240-242 , 2020
Link: https://doi.org/10.1109/..
 
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10

7.1 A 3.4-to-13.3TOPS/W 3.6TOPS Dual-Core Deep-Learning Acc..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Lin, Chien-Hung ; Cheng, Chih-Chung ; Tsai, Yi-Min... - p. 134-136 , 2020
Link: https://doi.org/10.1109/..
 
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11

Low-environmental-interference & highly-sensitive TMR biose..:

, In: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Kuo, Yi-Ching ; Lee, Hsin-Han ; Wang, Ding-Yeong... - p. 56-57 , 2020
Link: https://doi.org/10.1109/..
 
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12

What Does a Network Layer Hear? Analyzing Hidden Representa..:

, In: ICASSP 2020 - 2020 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Li, Chung-Yi ; Yuan, Pei-Chieh ; Lee, Hung-Yi - p. 6434-6438 , 2020
Link: https://doi.org/10.1109/..
 
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13

NTIRE 2020 Challenge on NonHomogeneous Dehazing:

, In: 2020 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops (CVPRW),
Ancuti, Codruta O. ; Ancuti, Cosmin ; Vasluianu, Florin-Alexandru... - p. 2029-2044 , 2020
Link: https://doi.org/10.1109/..
 
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14

A Novel Double-Density Hemi-Cylindrical (HC) Structure to P..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Lue, Hang-Ting ; Jiang, Yu-Wei ; Hung, Min-Feng... - p. 28.2.1-28.2.4 , 2019
Link: https://doi.org/10.1109/..
 
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15

Compact Folded Patch with Stretchable PDMS Substrate for On..:

, In: 2019 International Conference on Microwave and Millimeter Wave Technology (ICMMT),
Lee, Yong-Hong ; Lim, Eng-Hock ; Ng, Wai-Hau... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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