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Lee, Dana YL
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1

Advanced Thermocompression Bonding on High Density Fan-Out ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Wudjud, Wiwy ; Lin, ShuYu ; Chang, Yungshun... - p. 929-935 , 2024
Link: https://doi.org/10.1109/..
 
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Board Design Architecture and optimization for High-power 4..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Qin, Shijuan ; Chang, Patt ; Lee, Falconee... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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