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Lee, Deuk-Hwan
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1

An Overview of KMA's Operational NWP Data Assimilation Syst..:

, In: Data Assimilation for Atmospheric, Oceanic and Hydrologic Applications (Vol. IV),
Shin, Hyun-Cheol ; Ha, Ji-Hyun ; Ahn, Kwang Deuk... - p. 665-687 , 2022
Link: https://doi.org/10.1007/..
 
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2

Multi-modal Sensor Module for Outdoor Robots:

, In: 2020 IEEE International Conference on Consumer Electronics (ICCE),
Uhm, Taeyoung ; Park, Jeongwoo ; Bae, Gi-Doek.. - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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3

New metallic substrates for high thermal efficient TEC:

, In: 2007 26th International Conference on Thermoelectrics,
Kim, Bae-Yeon ; Seo, Won Seon ; Lee, Myung Hyun... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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4

An Explanation of the ICALT Instrument's Measurement of Tea..:

, In: Effective Teaching Around the World,
Chun, Seyeoung ; Lee, Okhwa ; Kim, Deuk-Joon - p. 299-315 , 2023
Link: https://doi.org/10.1007/..
 
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5

Applicability Analysis of Knowledge Graph Embedding on Blen..:

, In: 2022 International Conference on Platform Technology and Service (PlatCon),
Lee, Minkyung ; Jung, In-Su ; Kim, Deuk-Hun.. - p. 48-52 , 2022
Link: https://doi.org/10.1109/..
 
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6

LN2 forced flow cooling on HTS power cables:

, In: Proceedings of the Twentieth International Cryogenic Engineering Conference (ICEC20),
Koh, Deuk-Yong ; Yeom, Han-Kil ; Lee, Kwan-Soo - p. 641-644 , 2005
Link: https://doi.org/10.1016/..
 
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7

A 12b 50 MHz 3.3 V CMOS acquisition time minimized A/D conv..:

, In: Proceedings 2000. Design Automation Conference. (IEEE Cat. No.00CH37106),
Young-Deuk Jeon ; Byeong-Lyeol Jeon ; Seung-Chul Lee.. - p. 613,614,615,616 , 2000
Link: https://doi.org/10.1109/..
 
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8

A 900V HVIC Process with New Structure of Internal Bootstra..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Shin, Hong-Sik ; Jang, Hyun-Deuk ; Yu, Jin-Tae.. - p. 414-417 , 2024
Link: https://doi.org/10.1109/..
 
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9

Image Background Subtraction and Partial Stylization Based ..:

, In: Lecture Notes in Electrical Engineering; Information Science and Applications,
Kurniawan, Edwin ; Song, Bok-Deuk ; Choi, Yeon-Jun. - p. 19-30 , 2021
Link: https://doi.org/10.1007/..
 
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10

Motor Efficiency Determination of SynRM and Measurement Unc..:

, In: 2019 International Aegean Conference on Electrical Machines and Power Electronics (ACEMP) & 2019 International Conference on Optimization of Electrical and Electronic Equipment (OPTIM),
Kim, Youn-Hwan ; Jun, Hee-Deuk ; Moon, Jae-Won... - p. 233-239 , 2019
Link: https://doi.org/10.1109/..
 
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11

Development of CoAP-based IoT Communication System for Smar..:

, In: Proceedings of the 2nd International Symposium on Computer Science and Intelligent Control,
Choo, Young-Yeol ; Ha, Yong-Jun ; Kim, Young-Bu.. - p. 1-5 , 2018
Link: https://dl.acm.org/doi/1..
 
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12

Composition of Adhesives:

, In: Handbook of Adhesion Technology,
Kim, Hyun-Joong ; Lim, Dong-Hyuk ; Hwang, Hyeon-Deuk. - p. 291-314 , 2011
Link: https://doi.org/10.1007/..
 
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13

A 12b 50 MHz 3.3V CMOS acquisition time minimized A/D conve..:

, In: Proceedings of the 2000 Asia and South Pacific Design Automation Conference,
Jeon, Young-Deuk ; Jean, Byeong-Lyeol ; Lee, Seung-Chul.. - p. 613-616 , 2000
Link: https://dl.acm.org/doi/1..
 
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14

Pressureless transient liquid phase sintering bonding using..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Hwang, Byeong-Uk ; Min, Kyung Deuk ; Jung, Kwang-Ho... - p. 1855-1860 , 2020
Link: https://doi.org/10.1109/..
 
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15

Growth kinetics of intermetallic compound layers at the int..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Joo, Hong-Sub ; Min, Kyung Deuk ; Lee, Choong-Jae.. - p. 1916-1921 , 2020
Link: https://doi.org/10.1109/..
 
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