Lee, Haeyeon
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1

Modeling and Analysis of Simultaneous Switching Noise for F..:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Kim, Hyunwoo ; Choi, Seonguk ; Park, Joonsang... - p. 1-3 , 2023
 
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2

Crosstalk Mitigated On-chip Interconnect Design for High-sp..:

, In: 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Kim, Juneyoung ; Choi, Seonguk ; Kim, Seongguk... - p. 1-3 , 2023
 
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3

Design and Analysis of Hierarchical Power Distribution Netw..:

, In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
Kim, Hyunwoo ; Kim, Haeyeon ; Park, Joonsang... - p. 1-3 , 2022
 
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4

Design and Analysis of On-package Inductor of an Integrated..:

, In: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium,
Kim, Subin ; Jeong, Seungtaek ; Sim, Boogyo... - p. 498-503 , 2021
 
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