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Lee, Hsin-Chun
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1

Indoor Air Quality and Improvement Strategies of Using Mech..:

, In: 2023 9th International Conference on Applied System Innovation (ICASI),
Lee, Hsin-Chun ; Pan, Chen-Yu ; Hsu, Hsieh-Chih - p. 261-263 , 2023
Link: https://doi.org/10.1109/..
 
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2

U-MRAM PUF: A Novel Unipolar-MRAM for Power and Area Effici..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Shih, Ching ; Hong, Ming-Chun ; Wang, Chih-Yao... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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3

UAS Aerial Surveying in Resurvey Process of Cadastral Maps:

, In: 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE),
Yu, Feng-Chi ; Chung, Chin-Pin ; Lee, Hsin-Yi. - p. 30-33 , 2023
Link: https://doi.org/10.1109/..
 
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4

Brain and Spinal Tumors Originating from the Germ Line Cell:

, In: Advances in Experimental Medicine and Biology; Human Brain and Spinal Cord Tumors: From Bench to Bedside. Volume 2,
Wong, Tai-Tong ; Tsai, Min-Lan ; Chang, Hsi... - p. 421-455 , 2023
Link: https://doi.org/10.1007/..
 
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5

U-MRAM: Transistor-Less, High-Speed (10 ns), Low-Voltage (0..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Wu, Ming-Hung ; Hong, Ming-Chun ; Shih, Ching... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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6

Design of High-RA STT-MRAM for Future Energy-Efficient In-M..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Hong, Ming-Chun ; Su, Yi-Hui ; Chen, Guan-Long... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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7

A 4K–400K Wide Operating-Temperature-Range MRAM Technology ..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Hong, Ming-Chun ; Chang, Yao-Jen ; Hsin, Yu-Chen... - p. 379-380 , 2022
Link: https://doi.org/10.1109/..
 
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8

Visualizing the Invisible: Applying an Arts-Based Methodolo..:

, In: [ ] With Design: Reinventing Design Modes,
Ma, Min-yuan ; Chen, Ya-Lin ; Yeh, Lifen... - p. 175-196 , 2022
Link: https://doi.org/10.1007/..
 
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9

Miniature Haptics: Experiencing Haptic Feedback through Han..:

, In: Proceedings of the 2020 CHI Conference on Human Factors in Computing Systems,
Wang, Bo-Xiang ; Wang, Yu-Wei ; Chen, Yen-Kai... - p. 1-8 , 2020
Link: https://dl.acm.org/doi/1..
 
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10

Characteristic Analysis of a Multi-chip Embedded Interposer..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lee, Ching Kuan ; Liu, Wen-Hung ; Chang, Shu-Yi... - p. 55-56 , 2022
Link: https://doi.org/10.23919..
 
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11

A hybrid bonding interconnection with a novel low-temperatu..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Yu-Min ; Chang, Po-Chih ; Lee, Ou-Hsiang... - p. 2128-2134 , 2022
Link: https://doi.org/10.1109/..
 
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12

Flame Recognition System Using YoLo:

, In: Lecture Notes in Electrical Engineering; Frontier Computing,
Yang, Chao-Tung ; Lin, Wen-Yen ; Chen, Yi-Chun.. - p. 239-246 , 2021
Link: https://doi.org/10.1007/..
 
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13

DT-Track: Using DNS-Timing Side Channel for Mobile User Tra..:

, In: 2019 IEEE Conference on Dependable and Secure Computing (DSC),
Lin, Chun-Han ; Lee, Shan-Hsin ; Huang, Hsiu-Chuan... - p. 1-8 , 2019
Link: https://doi.org/10.1109/..
 
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14

Implementation of memory stacking on logic controller by us..:

, In: 2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA),
Chen, Shang-Chun ; Tzeng, Pei-Jer ; Hsm, Yu-Chen... - p. 1-2 , 2016
Link: https://doi.org/10.1109/..
 
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15

Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocry..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lin, Ang-Ying ; Lin, Yu-Min ; Lu, Chun-Lin... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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