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Proceedings of the 2024 International Symposium on Physical Design ,
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Reinforcement Learning or Simulated Annealing for Analog Pl..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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First Stacked Nanosheet FeFET Featuring Memory Window of 1...:
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Proceedings of the 43rd annual Design Automation Conference ,
3
A CMOS SoC for 56/18/16 CD/DVD-dual/RAM applications:
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2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ,
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Flow Boiling Heat Transfer Performance Comparison of Skived..:
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2022 IEEE International Conference on Recent Advances in Systems Science and Engineering (RASSE) ,
5
A Programmable CNN Accelerator with RISC-V Core in Real-Tim..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
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Contact Optimization Through Annealing and Edge Functionali..:
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2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) ,
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200mm GaN-on-Si E-Mode Power HEMTs with Epitaxially Grown p..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
8
34.4 A 3nm, 32.5TOPS/W, 55.0TOPS/mm2 and 3.78Mb/mm2 Fully-D..:
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2023 International Electron Devices Meeting (IEDM) ,
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Status and Performance of Integration Modules Toward Scaled..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Patch-type Flex SiP Platform for Heathcare Application:
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2023 IEEE International Solid- State Circuits Conference (ISSCC) ,
12
A 4nm 6163-TOPS/W/b $\mathbf{4790-TOPS/mm^{2}/b}$ SRAM Base..:
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2022 IEEE 12th International Conference on Consumer Electronics (ICCE-Berlin) ,
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