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Lee, Hyunjin
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1

Comfortable Mobility vs. Attractive Scenery: The Key to Aug..:

, In: Proceedings of the CHI Conference on Human Factors in Computing Systems,
Park, Hyerim ; Min, Aram ; Lee, Hyunjin... - p. 1-19 , 2024
Link: https://dl.acm.org/doi/1..
 
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2

Edge Detection Algorithm for Blurred Alignment Marks in Hyb..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Sugiura, Takamasa ; Nagatomo, Daisuke ; Kajinami, Masato... - p. 415-420 , 2023
Link: https://doi.org/10.1109/..
 
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3

Alignment Vision System for Hybrid Bonding:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Nagatomo, Daisuke ; Sugiura, Takamasa ; Kajinami, Masato... - p. 409-414 , 2023
Link: https://doi.org/10.1109/..
 
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4

Holistic Quantified-Self: An Integrated User Model for AR G..:

, In: 2023 IEEE International Symposium on Mixed and Augmented Reality Adjunct (ISMAR-Adjunct),
Song, Eunhwa ; Ha, Taewook ; Park, Junhyeok.. - p. 435-436 , 2023
Link: https://doi.org/10.1109/..
 
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5

Exploring the Effects of Augmented Reality Notification Typ..:

, In: 2023 IEEE Conference Virtual Reality and 3D User Interfaces (VR),
Lee, Hyunjin ; Woo, Woontack - p. 519-529 , 2023
Link: https://doi.org/10.1109/..
 
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6

Stress-less Dicing Solution for Thin and Large Die Handling..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Park, Sunwoo ; Kang, Sujie ; Shin, YongChul... - p. 183-186 , 2022
Link: https://doi.org/10.1109/..
 
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7

Exploring Augmented Reality Notification Placement while Co..:

, In: 2022 IEEE International Symposium on Mixed and Augmented Reality Adjunct (ISMAR-Adjunct),
Lee, Hyunjin ; Woo, Woontack - p. 686-689 , 2022
Link: https://doi.org/10.1109/..
 
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8

16 x 10 Pressure Sensor CMOS Driver IC for Resistance Inter..:

, In: 2022 19th International SoC Design Conference (ISOCC),
Lee, Jiseong ; Kwak, Seungsoo ; Im, Yun Chan.. - p. 284-285 , 2022
Link: https://doi.org/10.1109/..
 
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9

Modeling of Spreading Behavior of UV-Curable Dielectric Ink..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kang, Sujie ; Lee, Jung Shin ; Woo Cho, Jung... - p. 774-779 , 2022
Link: https://doi.org/10.1109/..
 
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10

Capless Low-Dropout Regulator with a Dual Feedback Loop and..:

, In: 2022 19th International SoC Design Conference (ISOCC),
Lee, Yun Seong ; Im, Yun Chan ; Lee, Hyunjin. - p. 298-299 , 2022
Link: https://doi.org/10.1109/..
 
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11

Direct Patterning of Conductive Fine Line in Dielectric Lay..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Lee, Jung Shin ; Cho, Jung Woo ; Park, Sun Woo... - p. 472-478 , 2020
Link: https://doi.org/10.1109/..
 
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12

Effects of Background Complexity and Viewing Distance on an..:

, In: 2020 IEEE International Symposium on Mixed and Augmented Reality Adjunct (ISMAR-Adjunct),
Lee, Hyunjin ; Bang, Sunyoung ; Woo, Woontack - p. 189-194 , 2020
Link: https://doi.org/10.1109/..
 
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13

Effects of Augmented Content's Placement and Size on User's..:

, In: 2020 IEEE International Symposium on Mixed and Augmented Reality Adjunct (ISMAR-Adjunct),
Bang, Sunyoung ; Lee, Hyunjin ; Woo, Woontack - p. 184-188 , 2020
Link: https://doi.org/10.1109/..
 
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14

A market-oriented wafer map optimization methodology using ..:

, In: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Kim, Jong-Seong ; Ahn, Chang Wook ; Kim, Tae-Woo.. - p. 393-398 , 2017
Link: https://doi.org/10.1109/..
 
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15

Recursive tessellation:

, In: SIGGRAPH Asia 2013 Posters,
Lee, Hyunjin ; Jeong, Yuna ; Lee, Sungkil - p. 1 ff. , 2013
Link: https://dl.acm.org/doi/1..
 
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