Lee, Jin-Oh
1016  results:
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1

End-user evaluation of an interface for clinical decision s..:

, In: 2022 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC),
Kehoe, Iain E. ; Pepino, Jeremy A. ; Lee, Jarone.. - p. 1149-1151 , 2022
 
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2

Data-driven Data Augmentation for Motor Imagery Brain-Compu..:

, In: 2021 International Conference on Information Networking (ICOIN),
Lee, Hyeon Kyu ; Lee, Ji-Hack ; Park, Jin-Oh. - p. 683-686 , 2021
 
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3

Robust Epileptic Seizure Detection Using Multiscale Distrib..:

, In: 2021 International Conference on Information Networking (ICOIN),
Park, Jin-Oh ; Lee, Dae-Young ; Choi, Young-Seok - p. 473-476 , 2021
 
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4

Integrating TCSC to enhance transmission capability and sec..:

, In: 2016 IEEE Power and Energy Society General Meeting (PESGM),
Hyun-Jae Lee ; Se-Hyun Kim ; Kyeon Hur... - p. 1-6 , 2016
 
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5

Bibliometric network analysis and visualization of research..:

, In: Proceedings of the 2018 IEEE/ACM International Conference on Advances in Social Networks Analysis and Mining,
Sohn, Eunsoo ; Noh, Kyung-Ran ; Lee, Bangrae. - p. 727-730 , 2018
 
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6

RFM analysis for detecting future core technology:

, In: Proceedings of the 2012 ACM Research in Applied Computation Symposium,
Kim, Dohyun ; Lee, June Young ; Ahn, Sejung.. - p. 55-59 , 2012
 
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7

Sequential Lung Nodule Synthesis Using Attribute-Guided Gen..:

, In: Medical Image Computing and Computer Assisted Intervention – MICCAI 2021; Lecture Notes in Computer Science,
Suh, Sungho ; Cheon, Sojeong ; Chang, Dong-Jin.. - p. 402-411 , 2021
 
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8

Highly Linear Charging/Discharging of Charge Trap FET Using..:

, In: 2024 International Conference on Electronics, Information, and Communication (ICEIC),
 
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9

Reliability of Indium Solder Joints using a Laser-Assisted ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Jung, Ji Eun ; Eom, Yong-Sung ; Joo, Jiho... - p. 2237-2243 , 2024
 
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10

Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bon..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 943-948 , 2024
 
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11

Laser-Assisted Bonding with Compression (LABC) based Tiling..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 1385-1389 , 2023
 
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12

Anisotropic Solder Paste (ASP) Material Solution for Laser ..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
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13

Process Window of Mini-LED Display Panel Packaging using La..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
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14

Laser-Assisted Bonding (LAB) Process and its Bonding Materi..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Choi, Kwang-Seong ; Joo, Jiho ; Choi, Gwang-Mun... - p. 198-203 , 2022
 
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15

Hang Out with the Language Assistant:

, In: 2019 International Conference on Multimodal Interaction,
Oh, Jin-hwan ; Sah, Sudhakar ; Kim, Jihoon... - p. 499-500 , 2019
 
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