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2024 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) ,
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A Low-power and Real-time Neural-Rendering Dense SLAM Proce..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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20.8 Space-Mate: A 303.5mW Real-Time Sparse Mixture-of-Expe..:
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2023 IEEE International Solid-State Circuits Conference (ISSCC) ,
3
16.5 DynaPlasia: An eDRAM In-Memory-Computing-Based Reconfi..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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NeRPIM: A 4.2 mJ/frame Neural Rendering Processing-in-memor..:
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2022 IEEE Asian Solid-State Circuits Conference (A-SSCC) ,
5
SNPU: Always-on 63.2μW Face Recognition Spike Domain Convol..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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High reliability performance of Ag-cored Au coated wire cap..:
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2021 Symposium on VLSI Circuits ,
7
OmniDRL: A 29.3 TFLOPS/W Deep Reinforcement Learning Proces..:
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2020 IEEE International Symposium on Circuits and Systems (ISCAS) ,
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A 54.7 fps 3D Point Cloud Semantic Segmentation Processor w..:
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2020 IEEE Symposium on VLSI Circuits ,
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A 146.52 TOPS/W Deep-Neural-Network Learning Processor with..:
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2020 IEEE International Solid- State Circuits Conference - (ISSCC) ,
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7.4 GANPU: A 135TFLOPS/W Multi-DNN Training Processor for G..:
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