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Lee, Ser Yee
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1

Contributors:

, In: Blumgart's Surgery of the Liver, Biliary Tract and Pancreas, 2-Volume Set,
Abou-Alfa, Ghassan K. ; Abou Khalil, Jad ; Addeo, Pietro... - p. viii-xxiv , 2017
Link: https://doi.org/10.1016/..
 
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2

Etiology, pathogenesis, and diagnostic assessment of acute ..:

, In: Blumgart's Surgery of the Liver, Biliary Tract and Pancreas, 2-Volume Set,
Lee, Ser Yee ; Goh, Brian K.P. ; Chan, Chung Yip - p. 883-896.e3 , 2017
Link: https://doi.org/10.1016/..
 
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3

Robust tracking control of an ironless linear motor with co..:

, In: 2017 56th Annual Conference of the Society of Instrument and Control Engineers of Japan (SICE),
En, Foo Jia ; Homg, Chong Shin ; Lee, Loh Ser - p. 1461-1466 , 2017
Link: https://doi.org/10.23919..
 
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4

Vision Optimization for Altitude Control and Object Trackin..:

, In: Lecture Notes in Electrical Engineering; Proceedings of the 11th National Technical Seminar on Unmanned System Technology 2019,
Keek, Joe Siang ; Mohd Aras, Mohd Shahrieel ; Md. Zain, Zainah... - p. 25-36 , 2020
Link: https://doi.org/10.1007/..
 
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5

Transforming Exploitative Land-Based Economy to Reduce Terr..:

, In: Springer Climate; Climate Change Research, Policy and Actions in Indonesia,
Goh, Chun Sheng ; Lee, Ser Huay Janice Teresa - p. 229-245 , 2020
Link: https://doi.org/10.1007/..
 
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6

Contributors:

, In: Decision-Making Techniques for Autonomous Vehicles,
Alonso, Marta ; Artuñedo, Antonio ; Camacho-Torregrosa, Francisco Javier... - p. xi-xii , 2023
Link: https://doi.org/10.1016/..
 
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7

Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packagin:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lianto, Prayudi ; Tan, Chin Wei ; Jie Peng, Qi... - p. 1126-1131 , 2020
Link: https://doi.org/10.1109/..
 
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8

A Compact Wafer-Level Heterogeneously Integrated Scalable O..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Nair Gourikutty, Sajay Bhuvanendran ; Wu, Jiaqi ; Lim, Teck Guan... - p. 1398-1403 , 2024
Link: https://doi.org/10.1109/..
 
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9

A Heterogeneously Integrated Wafer-level Processed Co-Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Nair Gourikutty, Sajay Bhuvanendran ; Long, Lau Boon ; Wei, Seit Wen... - p. 207-211 , 2023
Link: https://doi.org/10.1109/..
 
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10

The laser cavity electric connection line with SnAg solder ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chi, Ting Ta ; Li, Zhenyu ; Yu, Haitao... - p. 12-15 , 2023
Link: https://doi.org/10.1109/..
 
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11

Development and Reliability Evaluation of Large Scale Thin ..:

, In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC),
Bum, Lee Jong ; Choong, Chong Ser ; Yuen, Au Keng. - p. 2089-2094 , 2016
Link: https://doi.org/10.1109/..
 
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12

VIVA: Visual Exploration and Analysis of Videos with Intera..:

, In: Companion Proceedings of the 28th International Conference on Intelligent User Interfaces,
Ruangrotsakun, Anita ; Oh, Dayeon ; Nguyen, Thuy-Vy... - p. 162-165 , 2023
Link: https://dl.acm.org/doi/1..
 
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13

Pose-Aware Placement of Objects with Semantic Labels - Bran..:

, In: 2019 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS),
Su, Yung-Shan ; Yu, Lap-Fai ; Wang, Hsueh-Cheng... - p. 4760-4767 , 2019
Link: https://doi.org/10.1109/..
 
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14

Teaching with Soft Label Smoothing for Mitigating Noisy Lab..:

, In: Lecture Notes in Computer Science; Computer Vision – ECCV 2022,
Lukov, Tohar ; Zhao, Na ; Lee, Gim Hee. - p. 648-665 , 2022
Link: https://doi.org/10.1007/..
 
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15

Perceptions Towards MySejahtera, e-Penjana: Identifying Key..:

, In: 2021 3rd International Workshop on Artificial Intelligence and Education (WAIE),
Lee, Chien-Sing ; Chua, Ser-Jin ; Kok, Ming-Ho - p. 74-79 , 2021
Link: https://doi.org/10.1109/..
 
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