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Lee, Shu-Hsin
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1

Characteristic Analysis of a Multi-chip Embedded Interposer..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lee, Ching Kuan ; Liu, Wen-Hung ; Chang, Shu-Yi... - p. 55-56 , 2022
Link: https://doi.org/10.23919..
 
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2

Performance Improvement of DE Algorithm for Indoor Position..:

, In: Advanced Information Networking and Applications; Lecture Notes on Data Engineering and Communications Technologies,
Lee, Shu-Hung ; Cheng, Chia-Hsin ; Lu, Kuan-Hsien.. - p. 216-226 , 2024
Link: https://doi.org/10.1007/..
 
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3

A K-NN based Area Positioning System in Wireless Sensor Net..:

, In: 2023 12th International Conference on Awareness Science and Technology (iCAST),
Lee, Shu-Hung ; Cheng, Chia-Hsin ; Lu, Kuan-Hsien.. - p. 46-49 , 2023
Link: https://doi.org/10.1109/..
 
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4

Applications of Artificial Fish Swarm Algorithms for Indoor..:

, In: Innovative Mobile and Internet Services in Ubiquitous Computing; Lecture Notes on Data Engineering and Communications Technologies,
Lee, Shu-Hung ; Cheng, Chia-Hsin ; Lin, Chien-Chih. - p. 229-239 , 2023
Link: https://doi.org/10.1007/..
 
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5

Income Strategy:

, In: Digital Health Care in Taiwan,
Po-Chang Lee ; Chen, Mei-Hsin ; Chiang, Shu-Ching. - p. 17-31 , 2022
Link: https://doi.org/10.1007/..
 
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6

Contributors:

, In: Biofuels from Algae,
Amaro, Helena M. ; Assú Tessari, Lorenzo Ferrari ; Bernard, Olivier... - p. xvii-xxi , 2019
Link: https://doi.org/10.1016/..
 
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7

Chip Last Fanout Chip on Substrate (FOCoS) Solution for Chi..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lee, Teck-Chong ; Yang, Shu-Han ; Wu, Hsin-Yi. - p. 1970-1974 , 2022
Link: https://doi.org/10.1109/..
 
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8

Sharing Heterogeneous Spatial Knowledge: Map Fusion Between..:

, In: Springer Proceedings in Advanced Robotics; Robotics Research,
Lu, Yan ; Lee, Joseph ; Yeh, Shu-Hao... - p. 727-741 , 2019
Link: https://doi.org/10.1007/..
 
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9

A breakpoint-based silicon debug technique with cycle-granu..:

, In: Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition,
Chen, Hsin-Chen ; Wu, Cheng-Rong ; Li, Katherine Shu-Min. - p. 1281-1284 , 2015
Link: https://dl.acm.org/doi/1..
 
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10

The First CMOS-Integrated Voltage-Controlled MRAM with 0.7n..:

, In: 2023 International Electron Devices Meeting (IEDM),
Suhail, H. ; He, H. ; Yang, J.... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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11

Modeling and Simulation for DRAM and Flash Memory Technolog..:

, In: 2024 IEEE International Memory Workshop (IMW),
Lin, Xi-Wei ; Amoroso, Salvatore Maria ; Lee, Ko-Hsin... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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12

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
Link: https://doi.org/10.1109/..
 
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13

20.1 NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Eng..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Shih, Ming-En ; Hsieh, Shih-Wei ; Tsai, Ping-Yuan... - p. 360-362 , 2024
Link: https://doi.org/10.1109/..
 
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14

Ensemble Deep Learning Applied to Predict Building Energy C..:

, In: 2023 IEEE 6th Eurasian Conference on Educational Innovation (ECEI),
Lee, Zne-Jung ; Lin, Yun ; Chen, Zhong-Yuan... - p. 339-341 , 2023
Link: https://doi.org/10.1109/..
 
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15

Novel Automatic Feature Engineering for Carbon Emissions Pr..:

, In: 2023 IEEE 6th Eurasian Conference on Educational Innovation (ECEI),
Lee, Zne-Jung ; Lin, Yun ; Yang, Zhang... - p. 203-206 , 2023
Link: https://doi.org/10.1109/..
 
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