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Lee, Tzu-Ying
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1

Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsu, Mu-Ping ; Tsai, Wen-Tsu ; Lee, Ou-Hsiang... - p. 2131-2135 , 2024
Link: https://doi.org/10.1109/..
 
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2

Low Temperature and Fine Pitch Nanocrystalline Cu/SiCN Wafe..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chiu, Wei-Lan ; Lee, Ou-Hsiang ; Kuo, Tzu-Ying... - p. 1105-1109 , 2023
Link: https://doi.org/10.1109/..
 
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3

A Hybrid Buck Converter Stacked on Auxiliary-switched-capac..:

, In: ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC),
Wu, Tzu-Ying ; Shi-Jun, Zeng ; Wang, Tz-Wun... - p. 429-432 , 2023
Link: https://doi.org/10.1109/..
 
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4

Triple Binary SAR Control in Distributive Digital Low Dropo..:

, In: 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
Wu, Bo-Kuan ; Wu, Tzu-Ying ; Lee, Sheng Cheng... - p. 2919-2922 , 2022
Link: https://doi.org/10.1109/..
 
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5

The Immunogenetics of Photodermatoses:

, In: The Immunogenetics of Dermatologic Diseases; Advances in Experimental Medicine and Biology,
Lee, Chaw-Ning ; Chen, Tzu-Ying ; Wong, Tak-Wah - p. 369-381 , 2022
Link: https://doi.org/10.1007/..
 
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6

Motorcyclists' Head Motions Recognition by Using the Smart ..:

, In: 2019 Twelfth International Conference on Ubi-Media Computing (Ubi-Media),
Chen, Yu-Ren ; Tsai, Chang-Ming ; Wong, Ka-Io... - p. 157-163 , 2019
Link: https://doi.org/10.1109/..
 
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7

Improvement of Nanotwinned Copper Thermal Stability for Hig..:

, In: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Chiu, Wei-Lan ; Hung, Ying Tzu ; Lee, Ou-Hsiang... - p. 1-2 , 2021
Link: https://doi.org/10.1109/..
 
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8

In0.52Al0.48As Based Single Photon Avalanche Diodes with Mu..:

, In: 2023 Optical Fiber Communications Conference and Exhibition (OFC),
Wang, Po-Shun ; Hung, Yu-Ying ; Fang, Tzu-Yuan... - p. 1-3 , 2023
Link: https://doi.org/10.1364/..
 
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9

ICE: An Intelligent Cognition Engine with 3D NAND-based In-..:

, In: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO),
Hu, Han-Wen ; Wang, Wei-Chen ; Chang, Yuan-Hao... - p. 763-783 , 2022
Link: https://doi.org/10.1109/..
 
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10

Preserving Collusion-Free and Traceability in Car-Sharing S..:

, In: Communications in Computer and Information Science; New Trends in Computer Technologies and Applications,
Chen, Tzu-Hao ; Chew, Chit-Jie ; Chen, Ying-Chin. - p. 613-624 , 2022
Link: https://doi.org/10.1007/..
 
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11

A Dual-Mode Seamless Transition Low-Dropout Regulator with ..:

, In: 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
Tzeng, Tzu-Yu ; Lee, Sheng Cheng ; Chen, Ke-Horng... - p. 3058-3062 , 2022
Link: https://doi.org/10.1109/..
 
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12

High density batch bonding technology for chiplet design:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Lin, Ang-Ying ; Lin, Yu-Min ; Ni, Tzu-Hsuan.. - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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13

An Extremely Scaled Hemi-Cylindrical (HC) 3D NAND Device wi..:

, In: 2020 IEEE Symposium on VLSI Technology,
Du, Pei-Ying ; Lue, Hang-Ting ; Yeh, Teng-Hao... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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14

A Novel Double-Density Hemi-Cylindrical (HC) Structure to P..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Lue, Hang-Ting ; Jiang, Yu-Wei ; Hung, Min-Feng... - p. 28.2.1-28.2.4 , 2019
Link: https://doi.org/10.1109/..
 
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15

Automatic Damage Recovery of Old Photos Based on Convolutio..:

, In: 2019 International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS),
Kuo, Tien-Ying ; Wei, Yu-Jen ; Lee, Ming-Jui. - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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