Lee, Yong Gyu
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1

Foreign Object Detection in Wireless Power Transfer Using S..:

, In: 2022 IEEE 5th Student Conference on Electric Machines and Systems (SCEMS),
 
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2

Analysis of Electric Circuit and Magnetic Field Under Later..:

, In: 2022 IEEE 5th Student Conference on Electric Machines and Systems (SCEMS),
 
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3

Modeling of Frequency-Dependent Winding Losses in Solid and..:

, In: 2022 25th International Conference on Electrical Machines and Systems (ICEMS),
 
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4

Forming Limit Prediction of Multi-layered Metal-Polymer She..:

, In: Lecture Notes in Mechanical Engineering; Proceedings of the 14th International Conference on the Technology of Plasticity - Current Trends in the Technology of Plasticity,
Hou, Yong ; Moon, Chanmi ; Hu, Qi... - p. 455-462 , 2023
 
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5

A Novel XY-Plane Positioning Based on Point Approximation f..:

, In: 2023 IEEE/ACIS 8th International Conference on Big Data, Cloud Computing, and Data Science (BCD),
Oh, Seongjin ; Kim, Tae-yong ; Jeong, Jongpil... - p. 108-113 , 2023
 
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6

Improvement of Aperture Efficiency of Reflectarray Antenna ..:

, In: 2022 International Symposium on Antennas and Propagation (ISAP),
Nam, Yong-Hyun ; Kim, Yongjune ; Lee, Sun-Gyu. - p. 43-44 , 2022
 
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7

High-Efficiency Reconfigurable Reflectarray Based on Small ..:

, In: 2022 International Symposium on Antennas and Propagation (ISAP),
Lee, Sun-Gyu ; Nam, Yong-Hyun ; Kim, Yongjune.. - p. 41-42 , 2022
 
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8

Dynamic Deformation Behaviour of Al-Li Alloys Under High St..:

, In: The Minerals, Metals & Materials Series; NUMISHEET 2022,
Abd El-Aty, Ali ; Xu, Yong ; Zhang, Shi-Hong... - p. 733-745 , 2022
 
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9

A new creation environment for learning through interaction..:

, In: Proceedings of the 2014 ACM/IEEE international conference on Human-robot interaction,
Cho, Hye-Kyung ; Ryu, Jae-Sung ; Kim, Hyo-Yong... - p. 327 ff. , 2014
 
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10

A Study on the Thermal Budget of Ferroelectric TiN/Hf0.5Zr0..:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
 
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11

Efficiency improvement of power conversion system with mult..:

, In: 2020 IEEE International Conference on Consumer Electronics - Asia (ICCE-Asia),
 
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12

Multi-layer ceramic based surface mount device packaging fo..:

, In: 2020 IEEE International Conference on Consumer Electronics - Asia (ICCE-Asia),
 
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13

Power Conversion Module using LTCC substrate Interconnected..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
 
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15

Hallym Jikimi 3rd system : web-based monitoring for u-he..:

, In: Proceedings of the 4th International Conference on Persuasive Technology,
 
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