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Liang, En
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1

I Like Their Autonomy and Closeness to Me: Uncovering the P..:

, In: Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems,
Chou, Yu-Ling ; Lee, Hsuan-Jen ; Tsai, Jie.. - p. 1-19 , 2023
Link: https://dl.acm.org/doi/1..
 
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2

Are You Killing Time? Predicting Smartphone Users' Time-kil..:

, In: Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems,
Chen, Yu-Chun ; Lee, Yu-Jen ; Kao, Kuei-Chun... - p. 1-19 , 2023
Link: https://dl.acm.org/doi/1..
 
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3

Not Merely Deemed as Distraction: Investigating Smartphone ..:

, In: Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems,
Chang, Xi-Jing ; Hsu, Fang-Hsin ; Liang, En-Chi... - p. 1-17 , 2023
Link: https://dl.acm.org/doi/1..
 
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4

In-situ Observation of Underfill Dispensing Process:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Hu, Dyi Chung ; Hao Chen, Erh ; Lee, Jeffrey ChangBing.. - p. 57-58 , 2023
Link: https://doi.org/10.23919..
 
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5

Optimization of 2.2D Underfill Process by Novel Methodology..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sun, Chia-Peng ; Liang, Yu-En ; Hu, Dyi-Chung... - p. 175-180 , 2023
Link: https://doi.org/10.1109/..
 
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6

A Novel Modelling Methodology for Underfill Molding Process..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Liang, Yu En ; Sun, Chia Peng ; Hsu, Chih Chung... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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7

A Novel Equivalent Model for Underfill Molding Process On 2..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Liang, Yu En ; Sun, Chia Peng ; Hsu, Chih Chung... - p. 531-538 , 2022
Link: https://doi.org/10.1109/..
 
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8

Integrated Circuit Packaging:

, In: Molding Simulation: Theory and Practice,
Hsu, Chih-Chung ; Sun, Chia-Peng ; Wang, Chen-An. - p. 549-593 , 2022
Link: https://doi.org/10.1007/..
 
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9

Integrated Circuit Packaging:

, In: Molding Simulation: Theory and Practice,
Hsu, Chih-Chung (Jim) ; Sun, Chia-Peng (Victor) ; Wang, Chen-An (Jennan). - p. 549-593 , 2022
Link: https://doi.org/10.3139/..
 
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10

IBM Db2 Graph: Supporting Synergistic and Retrofittable Gra..:

, In: Proceedings of the 2020 ACM SIGMOD International Conference on Management of Data,
Tian, Yuanyuan ; Xu, En Liang ; Zhao, Wei... - p. 345-359 , 2020
Link: https://dl.acm.org/doi/1..
 
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11

A Differential Equation Solving Method Based on Fourier Ser..:

, In: 2022 8th Annual International Conference on Network and Information Systems for Computers (ICNISC),
Zou, Qiang ; Hu, En-liang - p. 977-980 , 2022
Link: https://doi.org/10.1109/..
 
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12

The Constraint Artificial-Intelligence Assisted Method for ..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Yang, Zusing ; Liang, Ying-Hung ; Tsai, Cheng-En... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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13

20.1 NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Eng..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Shih, Ming-En ; Hsieh, Shih-Wei ; Tsai, Ping-Yuan... - p. 360-362 , 2024
Link: https://doi.org/10.1109/..
 
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14

Scalable Incomplete Multi-View Clustering with Structure Al..:

, In: Proceedings of the 31st ACM International Conference on Multimedia,
Wen, Yi ; Wang, Siwei ; Liang, Ke... - p. 3031-3040 , 2023
Link: https://dl.acm.org/doi/1..
 
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15

A Physics-Informed Neural Networks Algorithm for Simulating..:

, In: 2023 International Applied Computational Electromagnetics Society Symposium (ACES-China),
Cao, Bo ; Wang, Yin-Da ; Zhang, Nian-En.. - p. 1-3 , 2023
Link: https://doi.org/10.23919..
 
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