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Liang, Hung-Wen
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1

Seeing Without Alarming Thief: Passive WiFi Sensing for Ind..:

, In: MILCOM 2023 - 2023 IEEE Military Communications Conference (MILCOM),
Chang, Shu-Ying ; Liang, Hung-Wen ; Nguyen, Van-Linh. - p. 239-240 , 2023
Link: https://doi.org/10.1109/..
 
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2

Flexible EM-Type Algorithms for Spatial Clustering:

, In: Advances in Intelligent Systems and Computing; Advances in Computer Communication and Computational Sciences,
Hung, Wen-Liang - p. 383-392 , 2018
Link: https://doi.org/10.1007/..
 
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3

Straight-line Generation Approach using Deep Learning for M..:

, In: 2023 9th International Conference on Applied System Innovation (ICASI),
Chang, Chung-Liang ; Chen, Hung-Wen - p. 187-189 , 2023
Link: https://doi.org/10.1109/..
 
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4

Integrated Design and Realization of 400-Gb/s Optical Trans..:

, In: 2019 International Workshop on Fiber Optics in Access Networks (FOAN),
Wang, Ling-Chi ; Wang, Hao-Lian ; Kuo, Zi-Yu... - p. 7-10 , 2019
Link: https://doi.org/10.1109/..
 
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5

Toward Automatic Recognition of Cursive Chinese Calligraphy..:

, In: 2020 14th International Conference on Ubiquitous Information Management and Communication (IMCOM),
Liang, Jung ; Liao, Wen-Hung ; Wu, Yi-Chieh - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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6

Applying Deep Convolutional Neural Network to Cursive Chine..:

, In: Communications in Computer and Information Science; New Trends in Computer Technologies and Applications,
Jung, Liang ; Liao, Wen-Hung - p. 646-653 , 2019
Link: https://doi.org/10.1007/..
 
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7

A 5.2-GHz Area-Efficient RF Front-End with 2.79x PAE Enhanc..:

, In: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024,
Yang, Teng-Shen ; Wang, Wei-Wen ; Hsu, Po-Yao. - p. 698-701 , 2024
Link: https://doi.org/10.1109/..
 
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8

FingerPuppet: Finger-Walking Performance-based Puppetry for..:

, In: Extended Abstracts of the 2024 CHI Conference on Human Factors in Computing Systems,
Hung, Ching-Wen ; Liang, Chung-Han ; Chen, Bing-Yu - p. 1-6 , 2024
Link: https://dl.acm.org/doi/1..
 
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9

Story-Time Machine-Low-Tech Attachment Design for Pre-schoo..:

, In: Lecture Notes in Computer Science; Human-Computer Interaction,
Chou, Wen-Huei ; Chang, Shi-Liang ; Hung, Chung-Wen - p. 41-55 , 2023
Link: https://doi.org/10.1007/..
 
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10

Puppeteer: Manipulating Human Avatar Actions with Intuitive..:

, In: The Adjunct Publication of the 35th Annual ACM Symposium on User Interface Software and Technology,
Hung, Ching-Wen ; Chang, Ruei-Che ; Chen, Hong-Sheng... - p. 1-3 , 2022
Link: https://dl.acm.org/doi/1..
 
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11

Puppeteer: Exploring Intuitive Hand Gestures and Upper-Body..:

, In: 28th ACM Symposium on Virtual Reality Software and Technology,
Hung, Ching-Wen ; Chang, Ruei-Che ; Chen, Hong-Sheng... - p. 1-11 , 2022
Link: https://dl.acm.org/doi/1..
 
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12

Advanced TIM Material Analysis for High Performance Package..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Jhan, Jyun-De ; Teng, Wen-Yu ; Hung, Liang-Yih.. - p. 229-230 , 2024
Link: https://doi.org/10.23919..
 
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13

Underfill Selection Guideline for Fan-Out Heterogeneous Int..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Teng, Wen-Yu ; Hung, Liang-Yih ; Lee, Jackson... - p. 1993-1997 , 2024
Link: https://doi.org/10.1109/..
 
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14

Stress and Reliability of Underfills in Heterogeneous Integ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Teng, Wen-Yu ; Lee, Jackson ; Hung, Liang-Yih.. - p. 235-236 , 2023
Link: https://doi.org/10.23919..
 
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15

Effect of Underfill Additive Agents on Crack Prevention in ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chen, Ching-Chia ; Teng, Wen-Yu ; Tsai, Fang Lin... - p. 477-480 , 2022
Link: https://doi.org/10.1109/..
 
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