Liang, Yu-Teng
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1

A 26nA Ultra-Low Input Current, 81nW Ultra-Low Power and 1μ..:

, In: ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC),
Lee, Sheng Cheng ; Liang, Yu-Teng ; Tsai, Hsing-Yen... - p. 317-320 , 2023
 
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2

Massively Parallel Simulation of Antenna Array Using Domain..:

, In: 2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting,
Zhang, Hao-Xuan ; Huang, Li. ; Zhou, Liang... - p. 1251-1252 , 2019
 
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3

Electromagnetic-Thermal Co-simulation of Large Antenna Arra..:

, In: 2019 International Applied Computational Electromagnetics Society Symposium - China (ACES),
Zhang, Hao-Xuan ; Huang, Li ; Zhou, Liang... - p. 1-2 , 2019
 
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4

A Privacy-Preserving Timing Attacks Mitigation in Informati..:

, In: 2023 IEEE International Conference on High Performance Computing & Communications, Data Science & Systems, Smart City & Dependability in Sensor, Cloud & Big Data Systems & Application (HPCC/DSS/SmartCity/DependSys),
Liu, Ningchun ; Gao, Shuai ; Liang, Teng... - p. 24-29 , 2023
 
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5

PCLive: Bringing Named Data Networking to Internet Livestre..:

, In: Proceedings of the 10th ACM Conference on Information-Centric Networking,
Liang, Teng ; Huang, Wei ; Ma, Xinyu... - p. 36-45 , 2023
 
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6

Low latency internet livestreaming in named data networking:

, In: Proceedings of the 9th ACM Conference on Information-Centric Networking,
Liang, Teng ; Zhang, Yang ; Zhang, Beichuan.. - p. 177-179 , 2022
 
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7

NDN in large LEO satellite constellations : a case of co..:

, In: Proceedings of the 8th ACM Conference on Information-Centric Networking,
Liang, Teng ; Xia, Zhongda ; Tang, Guoming.. - p. 1-12 , 2021
 
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8

Adapting Named Data Networking (NDN) for Better Consumer Mo..:

, In: Proceedings of the 24th International ACM Conference on Modeling, Analysis and Simulation of Wireless and Mobile Systems,
Xia, Zhongda ; Zhang, Yu ; Liang, Teng.. - p. 207-216 , 2021
 
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9

Underfill Selection Guideline for Fan-Out Heterogeneous Int..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Teng, Wen-Yu ; Hung, Liang-Yih ; Lee, Jackson... - p. 1993-1997 , 2024
 
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10

Advanced TIM Material Analysis for High Performance Package..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Jhan, Jyun-De ; Teng, Wen-Yu ; Hung, Liang-Yih.. - p. 229-230 , 2024
 
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11

Stress and Reliability of Underfills in Heterogeneous Integ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Teng, Wen-Yu ; Lee, Jackson ; Hung, Liang-Yih.. - p. 235-236 , 2023
 
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12

Effect of Underfill Additive Agents on Crack Prevention in ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chen, Ching-Chia ; Teng, Wen-Yu ; Tsai, Fang Lin... - p. 477-480 , 2022
 
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13

Stress and Reliability Challenges of Underfills in Large-Si..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Teng, Wen-Yu ; Lee, Jackson ; Tseng, Hsin-Ming... - p. 225-226 , 2022
 
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14

Relation-oriented resource allocation for multi-accelerator..:

, In: 2016 IEEE 27th International Conference on Application-specific Systems, Architectures and Processors (ASAP),
Teng Yu ; Bo Feng ; Stillwell, Mark... - p. 243-244 , 2016
 
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15

Innovated Methodology Improving CD Uniformity for Lithograp..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
 
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